Background:　Recently,　micro-light-emitting　diode　(micro-LED)　displays　have　gained　significant　interest　from　both　industry　and　academia　due　to　their　exceptional　performance.　However,　the　integration　of　micro-LED　with　the　driver　substrate　during　the　fabrication　process　remains　a　pressing　issue　that　needs　to　be　addressed.　Aim:　We　plan　to　realize　high-yield　bonding　of　micro-LED　displays　by　adopting　new　materials.　Approach:　We　opted　for　a　photoresist　with　conductive　properties　by　incorporating　carbon　black　as　the　bonding　material　to　fabricate　a　micron-level　bump　array.　Results:　This　method,　using　only　photolithography,　achieves　a　yield　of　99.99%　or　higher　in　a　single　step.　It　eliminates　the　need　for　time-consuming　processes　such　as　lift-off　and　vaporization　in　the　traditional　metal　bump　preparation　process.　The　resulting　array　can　be　directly　used　to　establish　electrical　connections　with　the　micro-LED　array.　After　fabrication　of　the　bump　array　on　the　thin　film　transistor　(TFT)　driver　substrate,　the　80x80　micro-LED　array　was　integrated　into　the　TFT　substrate,　and　after　baking,　a　device　yield　of　over　99.9%　was　attained.　Conclusions:　This　work　presents　a　streamlined　and　more　effective　method　for　integrating　the　micro-LED　and　TFT　driver　substrate,　resulting　in　significant　reductions　in　both　time　and　economic　expenses　associated　with　the　production　process　of　micro-LED　displays.　(c)　2024　Society　of　Photo-Optical　Instrumentation　Engineers　(SPIE)