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Abstract:
Background: Recently, micro-light-emitting diode (micro-LED) displays have gained significant interest from both industry and academia due to their exceptional performance. However, the integration of micro-LED with the driver substrate during the fabrication process remains a pressing issue that needs to be addressed. Aim: We plan to realize high-yield bonding of micro-LED displays by adopting new materials. Approach: We opted for a photoresist with conductive properties by incorporating carbon black as the bonding material to fabricate a micron-level bump array. Results: This method, using only photolithography, achieves a yield of 99.99% or higher in a single step. It eliminates the need for time-consuming processes such as lift-off and vaporization in the traditional metal bump preparation process. The resulting array can be directly used to establish electrical connections with the micro-LED array. After fabrication of the bump array on the thin film transistor (TFT) driver substrate, the 80 × 80 micro-LED array was integrated into the TFT substrate, and after baking, a device yield of over 99.9% was attained. Conclusions: This work presents a streamlined and more effective method for integrating the micro-LED and TFT driver substrate, resulting in significant reductions in both time and economic expenses associated with the production process of micro- LED displays. © 2024 Society of Photo-Optical Instrumentation Engineers (SPIE).
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Nanopatterning, Materials and Metrology
ISSN: 2708-8340
Year: 2024
Issue: 4
Volume: 23
Page: 44901-
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ESI Highly Cited Papers on the List: 0 Unfold All
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30 Days PV: 1
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