A　novel　type　of　silicon-based,　mechanical,　electro-thermal　probe　array　has　been　successfully　developed　for　high　density　data　storage.　In　addition　to　theoretical　analysis　and　finite　element　simulation,　a　combination　of　cross-disciplined　technologies　have　been　used　in　its　design　and　fabrication,　including　fabrication　of　silicon　nano-tip　and　high-electrical-insulation　resistive　heater,　as　well　as　the　integration　of　heater　and　piezo-resistor　on　nanometer-scale　electro-mechanical-system　(NEMS)　probe　and　(micro-)　nano-machining.　We　found　that　the　piezo-resistive　sensitivity　of　the　cantilever　and　the　tip,　with　its　apex　diameter　less　than　40　nanometer,　work　well　in　high　density　storage.　An　electro-thermal　model　was　developed　and　the　simulation　agrees　fairly　well　with　experiments.