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author:

Huang, Guo-Qiang (Huang, Guo-Qiang.) [1] | Mao, Jun-Nan (Mao, Jun-Nan.) [2] | Wang, Hong-Xing (Wang, Hong-Xing.) [3] | Hua, Chao (Hua, Chao.) [4]

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Abstract:

A CVD model of polysilicon in Trichlorosilane-Hydrogen system is established, coupling gas phase reactions and surface reactions by Chemkin 4.0, then numerical solution by CFD software Fluent 6.3.26 is made. According to model results, silicon growth rate curves regarding gas inlet temperature, gas composition, surface temperature and reaction pressure are plotted, addressing silicon growth rate with different conditions while the model for this deposition process has been compared to experimental and calculated data obtained from literature. As a result, assuming all other conditions constant, silicon growth rate increases with increase of surface temperature, reactor pressure as well as gas inlet temperature, when hydrogen mole fraction is less than 0.8, silicon growth rate is proportional to hydrogen mole fraction, when more than 0.8, silicon growth rate is on the contrary.

Keyword:

Atmospheric temperature Chemical vapor deposition Computer simulation Growth rate Hydrogen Mass transfer Polysilicon Surface properties Surface reactions Temperature measuring instruments Three dimensional

Community:

  • [ 1 ] [Huang, Guo-Qiang]College of Chemical Engineering, Tianjin University, Tianjin 300072, China
  • [ 2 ] [Mao, Jun-Nan]College of Chemical Engineering, Tianjin University, Tianjin 300072, China
  • [ 3 ] [Wang, Hong-Xing]College of Chemical Engineering, Fuzhou University, Fuzhou 350002, China
  • [ 4 ] [Hua, Chao]Institute of Process Engineering, Chinese Academy of Sciences, Beijing 100190, China

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Source :

Journal of Synthetic Crystals

ISSN: 1000-985X

CN: 11-2637/O7

Year: 2012

Issue: 3

Volume: 41

Page: 680-686

Cited Count:

WoS CC Cited Count: 0

SCOPUS Cited Count:

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 1

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