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author:

Pan, Youlin (Pan, Youlin.) [1] | Liu, Genggeng (Liu, Genggeng.) [2] | Huang, Xing (Huang, Xing.) [3] | Li, Zipeng (Li, Zipeng.) [4] | Huang, Hsin-Chuan (Huang, Hsin-Chuan.) [5] | Liang, Chi-Chun (Liang, Chi-Chun.) [6] | Wang, Qining (Wang, Qining.) [7] | Kim, Chang-Jin (Kim, Chang-Jin.) [8] | Ho, Tsung-Yi (Ho, Tsung-Yi.) [9]

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EI

Abstract:

With the advances in microfluidics, electrowetting-on-dielectric (EWOD) chips have widely been applied to various biological and chemical laboratory protocols. Glass-based EWOD chips with nonregular electrodes are proposed, which allow more reliable droplet operations and facilitate the integration of optical sensors for many biochemical applications. Furthermore, nonregular electrode designs are utilized in EWOD chips, e.g., interdigitated electrodes for more reliable droplet manipulation, custom shaped electrodes for specific applications like concentric heating, etc. However, due to the technical challenges of fabricating multilayer interconnection on the glass substrate, e.g., unreliable process and high cost, both control electrodes and wires are fabricated with a single-layer configuration, which poses significant challenges to pin selection for nonregular electrodes. In this article, we propose a minimum-cost flow-based routing algorithm called NR-Router+ that features efficient and robust routing for single-layer EWOD chips with nonregular electrodes. To the best of our knowledge, this is the first work that overcomes the aforementioned challenges. We construct a minimum-cost flow algorithm to generate optimal routing paths followed by a light-weight model to handle flow capacity. A grid reduction strategy is proposed to reduce the computational overhead. Additionally, a flow collocation algorithm based on integer linear programming is presented to efficiently prevent wire overlapping. Experimental results show that NR-Router+ achieves 100% routability while minimizing wirelength with shorter run time. Moreover, NR-Router+ can generate mask files feasible for manufacturing via adjustments of design parameters, thus demonstrating its robustness and efficiency. © 1982-2012 IEEE.

Keyword:

Chip scale packages Dielectric devices Drops Electrodes Glass Glass substrates Integer programming Wetting Wire

Community:

  • [ 1 ] [Pan, Youlin]Northwestern Polytechnical University, School of Computer Science, Xi'an; 710072, China
  • [ 2 ] [Pan, Youlin]Fuzhou University, College of Computer and Data Science, Fuzhou; 350116, China
  • [ 3 ] [Liu, Genggeng]Fuzhou University, College of Computer and Data Science, Fuzhou; 350116, China
  • [ 4 ] [Huang, Xing]Northwestern Polytechnical University, School of Computer Science, Xi'an; 710072, China
  • [ 5 ] [Li, Zipeng]Apple Inc., Silicon Engineering Group, Cupertino; CA; 95014, United States
  • [ 6 ] [Huang, Hsin-Chuan]National Tsing Hua University, Department of Computer Science, Hsinchu; 300044, Taiwan
  • [ 7 ] [Liang, Chi-Chun]National Tsing Hua University, Department of Computer Science, Hsinchu; 300044, Taiwan
  • [ 8 ] [Wang, Qining]University of California at Los Angeles, Mechanical and Aerospace Engineering Department, Los Angeles; CA; 90095, United States
  • [ 9 ] [Kim, Chang-Jin]University of California at Los Angeles, Mechanical and Aerospace Engineering Department, Los Angeles; CA; 90095, United States
  • [ 10 ] [Ho, Tsung-Yi]The Chinese University of Hong Kong, Department of Computer Science and Engineering, Hong Kong, Hong Kong

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Source :

IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems

ISSN: 0278-0070

Year: 2024

Issue: 9

Volume: 43

Page: 2606-2619

2 . 7 0 0

JCR@2023

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ESI Highly Cited Papers on the List: 0 Unfold All

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30 Days PV: 0

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