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author:

Wang, Jundong (Wang, Jundong.) [1] | Hu, Kun (Hu, Kun.) [2] | Sun, Weiwei (Sun, Weiwei.) [3] | Wang, Haibo (Wang, Haibo.) [4] | Yang, Guijuan (Yang, Guijuan.) [5] | Wang, Kunlan (Wang, Kunlan.) [6] | Guo, LinXinzheng (Guo, LinXinzheng.) [7] | Zhang, Fan (Zhang, Fan.) [8] | Lin, Guangqin (Lin, Guangqin.) [9] | Yi, HanPing (Yi, HanPing.) [10] | Wei, Yen (Wei, Yen.) [11] | Li, Luhai (Li, Luhai.) [12]

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EI

Abstract:

Printed electronics is an electronic device manufacturing technology that combines printing technology and high-end conductive materials. Compared with traditional electronic manufacturing methods, it does not rely on substrate materials, can be manufactured in large areas and in batches, reduce manufacturing costs, and is green and other advantages. Printed electronics technology can prepare sensors, flexible display devices, radio frequency identification tags, printed circuit boards, etc. This article mainly introduces the research progress in these four fields. The development of Printed electronics should focus on strengthening the research on printable electronic materials and printing substrates. Performance enhancements will further expand the range of printed electronics applications. © 2021, The Author(s), under exclusive license to Springer Nature Singapore Pte Ltd.

Keyword:

Chip scale packages Conductive materials Electronics industry Flexible displays Green manufacturing Packaging materials Printed circuit boards Radio frequency identification (RFID) Substrates Visual communication

Community:

  • [ 1 ] [Wang, Jundong]Beijing Institute of Graphic Communication, Beijing, China
  • [ 2 ] [Wang, Jundong]Institute of Printing and Packaging Engineering, Yen Wei, China
  • [ 3 ] [Wang, Jundong]Beijing Engineering Research Center of Printed Electronics, Beijing, China
  • [ 4 ] [Hu, Kun]Beijing Institute of Graphic Communication, Beijing, China
  • [ 5 ] [Hu, Kun]Institute of Printing and Packaging Engineering, Yen Wei, China
  • [ 6 ] [Hu, Kun]Beijing Engineering Research Center of Printed Electronics, Beijing, China
  • [ 7 ] [Hu, Kun]Fuzhou University College of Biological Science and Engineering, Fujian, China
  • [ 8 ] [Sun, Weiwei]Beijing Institute of Graphic Communication, Beijing, China
  • [ 9 ] [Sun, Weiwei]Institute of Printing and Packaging Engineering, Yen Wei, China
  • [ 10 ] [Sun, Weiwei]Beijing Engineering Research Center of Printed Electronics, Beijing, China
  • [ 11 ] [Wang, Haibo]Beijing Institute of Graphic Communication, Beijing, China
  • [ 12 ] [Wang, Haibo]Institute of Printing and Packaging Engineering, Yen Wei, China
  • [ 13 ] [Wang, Haibo]Beijing Engineering Research Center of Printed Electronics, Beijing, China
  • [ 14 ] [Yang, Guijuan]Beijing Institute of Graphic Communication, Beijing, China
  • [ 15 ] [Yang, Guijuan]Institute of Printing and Packaging Engineering, Yen Wei, China
  • [ 16 ] [Yang, Guijuan]Beijing Engineering Research Center of Printed Electronics, Beijing, China
  • [ 17 ] [Wang, Kunlan]Beijing Institute of Graphic Communication, Beijing, China
  • [ 18 ] [Wang, Kunlan]Institute of Printing and Packaging Engineering, Yen Wei, China
  • [ 19 ] [Wang, Kunlan]Beijing Engineering Research Center of Printed Electronics, Beijing, China
  • [ 20 ] [Guo, LinXinzheng]Beijing Institute of Graphic Communication, Beijing, China
  • [ 21 ] [Guo, LinXinzheng]Institute of Printing and Packaging Engineering, Yen Wei, China
  • [ 22 ] [Guo, LinXinzheng]Beijing Engineering Research Center of Printed Electronics, Beijing, China
  • [ 23 ] [Zhang, Fan]The First Hospital of Fuzhou Medical Association, Fujian, China
  • [ 24 ] [Lin, Guangqin]Fujian HuaRui Biological Technology Co., Ltd., Fuzhou, China
  • [ 25 ] [Yi, HanPing]Guangxi Bauhinia Biotechnology Co., Ltd., Liuzhou, China
  • [ 26 ] [Wei, Yen]Department of Chemistry and Tsinghua Center for Frontier Polymer Research, Tsinghua University, Beijing, China
  • [ 27 ] [Li, Luhai]Beijing Institute of Graphic Communication, Beijing, China
  • [ 28 ] [Li, Luhai]Institute of Printing and Packaging Engineering, Yen Wei, China
  • [ 29 ] [Li, Luhai]Beijing Engineering Research Center of Printed Electronics, Beijing, China

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Source :

ISSN: 1876-1100

Year: 2021

Volume: 754 LNEE

Page: 358-365

Language: English

Cited Count:

WoS CC Cited Count: 0

SCOPUS Cited Count: 1

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 5

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