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author:

Wang, Chengxin (Wang, Chengxin.) [1] (Scholars:王成鑫) | Tian, Fangxin (Tian, Fangxin.) [2] | Wang, Tongqing (Wang, Tongqing.) [3] | Liu, Bangxu (Liu, Bangxu.) [4] | Lu, Xinchun (Lu, Xinchun.) [5]

Indexed by:

EI Scopus SCIE

Abstract:

The eddy-current method has been employed to realize the real-time measurement of thickness distribution and polishing endpoint detection of metal films during the metal chemical mechanical polishing (CMP) process. However, accuracy and sensitivity in thickness measurement can be significantly impacted by a variation in lift-off distance (about 3.5 mm), attributable to the progressive wear of the polishing pad. This paper proposes a novel triple-coil sensor system, integrated with an alternating-current bridge and designed for high-precision metal film thickness measurement. Subsequently, the measurement performance of the bridge output voltage was scrutinized using a theoretical model and a trans-dimensional finite element analysis model of electromagnetic fields and circuit coupling. The correlations between the amplitude, phase, and the ratio of the real part to the imaginary part of the output voltage, in context with film thickness, were determined at assorted excitation frequencies and lift-off distances. Both theoretical equations and simulation results affirmed that the phase and ratio were more resistant to lift-off distance variations than the amplitude, and a linear relationship was identified between the ratio and film thickness. Furthermore, the thickness measurement performance of the amplitude and phase, when the triple-coil was imbalanced, was dissected via numerical simulation. A profound understanding of the proposed system was provided and beneficial for the practical applications in real-time thickness measurements of metal films during the metal CMP process.

Keyword:

Chemical mechanical polishing Eddy-current Lift-off distance Triple-coil

Community:

  • [ 1 ] [Wang, Chengxin]Tsinghua Univ, State Key Lab Tribol Adv Equipment, Beijing, Peoples R China
  • [ 2 ] [Tian, Fangxin]Tsinghua Univ, State Key Lab Tribol Adv Equipment, Beijing, Peoples R China
  • [ 3 ] [Wang, Tongqing]Tsinghua Univ, State Key Lab Tribol Adv Equipment, Beijing, Peoples R China
  • [ 4 ] [Liu, Bangxu]Tsinghua Univ, State Key Lab Tribol Adv Equipment, Beijing, Peoples R China
  • [ 5 ] [Lu, Xinchun]Tsinghua Univ, State Key Lab Tribol Adv Equipment, Beijing, Peoples R China
  • [ 6 ] [Wang, Chengxin]Hwatsing Technol Co Ltd, Tianjin 300350, Peoples R China
  • [ 7 ] [Tian, Fangxin]Hwatsing Technol Co Ltd, Tianjin 300350, Peoples R China
  • [ 8 ] [Wang, Tongqing]Hwatsing Technol Co Ltd, Tianjin 300350, Peoples R China
  • [ 9 ] [Lu, Xinchun]Hwatsing Technol Co Ltd, Tianjin 300350, Peoples R China
  • [ 10 ] [Wang, Chengxin]Fuzhou Univ, Sch Mech Engn & Automation, Fuzhou 350116, Peoples R China

Reprint 's Address:

  • [Lu, Xinchun]Tsinghua Univ, State Key Lab Tribol Adv Equipment, Beijing, Peoples R China;;[Lu, Xinchun]Hwatsing Technol Co Ltd, Tianjin 300350, Peoples R China

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Source :

INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY

ISSN: 0268-3768

Year: 2024

Issue: 11-12

Volume: 132

Page: 5249-5258

2 . 9 0 0

JCR@2023

CAS Journal Grade:4

Cited Count:

WoS CC Cited Count: 2

SCOPUS Cited Count: 1

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 0

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