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学者姓名：王成鑫
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Abstract ：
High-precision eddy current sensors for displacement and thickness measurement play a crucial role in vital fields such as semiconductor manufacturing, precision optics, and aerospace. As precision manufacturing advances towards digitalization and intelligence, the performance and functionality of these sensors face increasingly stringent demands. In this review, the analytical and equivalent circuit model of eddy current detection are analyzed from the basic structure and working principle, obtaining the application branch of displacement and thickness measurement. The optimization of configuration, signal processing circuitry, and temperature compensation technology is reviewed for the improvement of core performance indicators such as range, resolution, and thermal stability. The challenges faced in practical applications, including the suppression of lift-off effect, multilayer film thickness measurement and edge detection, are identified. Finally, the development direction of eddy current displacement and thickness sensors is envisioned.
Keyword ：
Displacement measurement Displacement measurement Eddy current sensors Eddy current sensors Lift-off effect Lift-off effect Resolution Resolution Thickness measurement Thickness measurement
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| GB/T 7714 | Zhao, Guangen , Huang, Yuhua , Zhang, Wenwei et al. Advances in high-precision displacement and thickness measurement based on eddy current sensors: A review [J]. | MEASUREMENT , 2025 , 243 . |
| MLA | Zhao, Guangen et al. "Advances in high-precision displacement and thickness measurement based on eddy current sensors: A review" . | MEASUREMENT 243 (2025) . |
| APA | Zhao, Guangen , Huang, Yuhua , Zhang, Wenwei , Wang, Chengxin , Chen, Jianxiong . Advances in high-precision displacement and thickness measurement based on eddy current sensors: A review . | MEASUREMENT , 2025 , 243 . |
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This study investigates the effect of spinodal decomposition pores on the shear strength of nano silver (nAg) used as a die attach material in electronic packaging. The formation of porous nAg structures with varying porosity levels is simulated using the Cahn-Hilliard equation, with the initial nAg concentration controlling the porosity rate. Molecular dynamics simulations are then employed to evaluate the mechanical response of the porous nAg under shear deformation. The results demonstrate that increasing porosity significantly decreases the ultimate shear strength. Furthermore, detailed analyses of surface area evolution, stress distribution, and dislocation density reveal the intricate interplay between porosity and deformation mechanisms. Highly porous nAg exhibits a more uniform stress distribution and lower dislocation accumulation compared to low-porosity structures. The findings provide valuable insights into optimizing the porosity of nAg for enhanced mechanical reliability in electronic packaging applications. The proposed modeling framework can be extended to other material systems for exploring microstructure-property relationships.
Keyword ：
Cahn-Hilliard equation Cahn-Hilliard equation Electronic reliability Electronic reliability Nano Silver Nano Silver Porosity Porosity Shear stress Shear stress
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| GB/T 7714 | Huang, Yuhua , Wang, Chengxin , Sun, Kailin et al. Effect of Spinodal Decomposition Pore on Shear Strength of Silver [J]. | 2024 25TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, ICEPT , 2024 . |
| MLA | Huang, Yuhua et al. "Effect of Spinodal Decomposition Pore on Shear Strength of Silver" . | 2024 25TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, ICEPT (2024) . |
| APA | Huang, Yuhua , Wang, Chengxin , Sun, Kailin , Mou, Yun , Wang, Shizhao . Effect of Spinodal Decomposition Pore on Shear Strength of Silver . | 2024 25TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, ICEPT , 2024 . |
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The eddy-current method has been employed to realize the real-time measurement of thickness distribution and polishing endpoint detection of metal films during the metal chemical mechanical polishing (CMP) process. However, accuracy and sensitivity in thickness measurement can be significantly impacted by a variation in lift-off distance (about 3.5 mm), attributable to the progressive wear of the polishing pad. This paper proposes a novel triple-coil sensor system, integrated with an alternating-current bridge and designed for high-precision metal film thickness measurement. Subsequently, the measurement performance of the bridge output voltage was scrutinized using a theoretical model and a trans-dimensional finite element analysis model of electromagnetic fields and circuit coupling. The correlations between the amplitude, phase, and the ratio of the real part to the imaginary part of the output voltage, in context with film thickness, were determined at assorted excitation frequencies and lift-off distances. Both theoretical equations and simulation results affirmed that the phase and ratio were more resistant to lift-off distance variations than the amplitude, and a linear relationship was identified between the ratio and film thickness. Furthermore, the thickness measurement performance of the amplitude and phase, when the triple-coil was imbalanced, was dissected via numerical simulation. A profound understanding of the proposed system was provided and beneficial for the practical applications in real-time thickness measurements of metal films during the metal CMP process.
Keyword ：
Chemical mechanical polishing Chemical mechanical polishing Eddy-current Eddy-current Lift-off distance Lift-off distance Triple-coil Triple-coil
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| GB/T 7714 | Wang, Chengxin , Tian, Fangxin , Wang, Tongqing et al. Computational investigation of a novel metal thickness measurement system with coaxial triple-coil sensor for chemical mechanical polishing [J]. | INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY , 2024 , 132 (11-12) : 5249-5258 . |
| MLA | Wang, Chengxin et al. "Computational investigation of a novel metal thickness measurement system with coaxial triple-coil sensor for chemical mechanical polishing" . | INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY 132 . 11-12 (2024) : 5249-5258 . |
| APA | Wang, Chengxin , Tian, Fangxin , Wang, Tongqing , Liu, Bangxu , Lu, Xinchun . Computational investigation of a novel metal thickness measurement system with coaxial triple-coil sensor for chemical mechanical polishing . | INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY , 2024 , 132 (11-12) , 5249-5258 . |
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Silicon carbide (SiC) is extremely hard and brittle, posing challenges for traditional abrasive machining. This study used molecular dynamics simulations to investigate synchronous versus asynchronous force -torque effects on SiC abrasive machining. Multi-grit diamond abrasion of 4H-SiC was modeled by applying controlled sinusoidal forces and torques. Asynchronous force -torque increased material removal rates up to 2X versus synchronous conditions by promoting particle agglomeration and enabling trapped particles to contribute. However, asynchronous operation also produced higher surface roughness and subsurface cracking from greater penetration. The alternating forces generated larger stresses that may have driven more plastic deformation and brittle fracture. The study provided atomic-scale insights into force -torque effects, establishing guidelines to potentially enhance efficiency through asynchronous operation despite drawbacks.
Keyword ：
Abrasive machining Abrasive machining Force -torque synchronization Force -torque synchronization Molecular dynamics Molecular dynamics Silicon carbide Silicon carbide
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| GB/T 7714 | Chen, Hui , Wang, Chengxin , Chen, Jianxiong et al. Changing torque-force synchronization condition for abrasive particle improves material removal during silicon carbide abrasive machining [J]. | TRIBOLOGY INTERNATIONAL , 2024 , 192 . |
| MLA | Chen, Hui et al. "Changing torque-force synchronization condition for abrasive particle improves material removal during silicon carbide abrasive machining" . | TRIBOLOGY INTERNATIONAL 192 (2024) . |
| APA | Chen, Hui , Wang, Chengxin , Chen, Jianxiong , Xie, Yu , Sun, Kailin , Huang, Yuhua et al. Changing torque-force synchronization condition for abrasive particle improves material removal during silicon carbide abrasive machining . | TRIBOLOGY INTERNATIONAL , 2024 , 192 . |
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| GB/T 7714 | Wang, Chengxin , Tian, Fangxin , Wang, Tongqing et al. Computational investigation of a novel metal thickness measurement system with coaxial triple-coil sensor for chemical mechanical polishing (Apr, 10.1007/s00170-024-13677-7, 2024) [J]. | INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY , 2024 , 132 (11-12) : 5259-5260 . |
| MLA | Wang, Chengxin et al. "Computational investigation of a novel metal thickness measurement system with coaxial triple-coil sensor for chemical mechanical polishing (Apr, 10.1007/s00170-024-13677-7, 2024)" . | INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY 132 . 11-12 (2024) : 5259-5260 . |
| APA | Wang, Chengxin , Tian, Fangxin , Wang, Tongqing , Liu, Bangxu , Lu, Xinchun . Computational investigation of a novel metal thickness measurement system with coaxial triple-coil sensor for chemical mechanical polishing (Apr, 10.1007/s00170-024-13677-7, 2024) . | INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY , 2024 , 132 (11-12) , 5259-5260 . |
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