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author:

Cui, M. (Cui, M..) [1] | Zhou, J. (Zhou, J..) [2] | Zheng, S. (Zheng, S..) [3] | Liu, N. (Liu, N..) [4] | Liang, J. (Liang, J..) [5] | Hu, W. (Hu, W..) [6] (Scholars:胡炜) | Liu, Y. (Liu, Y..) [7] | Hao, Y. (Hao, Y..) [8] | Han, G. (Han, G..) [9]

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Abstract:

We propose a novel technology called depolarization field engineered ferroelectric mechanical transistor (Fe-MT), which achieves an exceptionally low operating voltage ( VDD) of 0.3 volts. This achievement of VDD scaling is made possible by utilizing depolarization voltage with an amplitude of 11/-11.1 V for the pre-shrinkage of contact gap ( gC) [Fig. 1], which is activated by a + 63/-66 V pulse stimulus. Additionally, our Fe-MTs maintain the device-level reconfigurability between N/P modes. This exciting development suggests that our Fe-MTs can serve as the fundamental building blocks for future generations of integrated circuits with high energy and area-efficiency.  © 1980-2012 IEEE.

Keyword:

depolarization field Ferroelectric micro-electro-mechanical (MEM) operating voltage reconfigurability

Community:

  • [ 1 ] [Cui M.]Hangzhou Institute of Technology, Xidian University, Hangzhou, 311200, China
  • [ 2 ] [Cui M.]Xidian University, School of Microelectronics, Xi'an, 710126, China
  • [ 3 ] [Zhou J.]Hangzhou Institute of Technology, Xidian University, Hangzhou, 311200, China
  • [ 4 ] [Zhou J.]Xidian University, School of Microelectronics, Xi'an, 710126, China
  • [ 5 ] [Zheng S.]Hangzhou Institute of Technology, Xidian University, Hangzhou, 311200, China
  • [ 6 ] [Zheng S.]Xidian University, School of Microelectronics, Xi'an, 710126, China
  • [ 7 ] [Liu N.]Hangzhou Institute of Technology, Xidian University, Hangzhou, 311200, China
  • [ 8 ] [Liu N.]Xidian University, School of Microelectronics, Xi'an, 710126, China
  • [ 9 ] [Liang J.]Shanghai University, School of Microelectronics, Shanghai, 201800, China
  • [ 10 ] [Hu W.]Fuzhou University, College of Physics and Information Engineering, Fuzhou, 350108, China
  • [ 11 ] [Liu Y.]Hangzhou Institute of Technology, Xidian University, Hangzhou, 311200, China
  • [ 12 ] [Liu Y.]Xidian University, School of Microelectronics, Xi'an, 710126, China
  • [ 13 ] [Hao Y.]Hangzhou Institute of Technology, Xidian University, Hangzhou, 311200, China
  • [ 14 ] [Hao Y.]Xidian University, School of Microelectronics, Xi'an, 710126, China
  • [ 15 ] [Han G.]Hangzhou Institute of Technology, Xidian University, Hangzhou, 311200, China
  • [ 16 ] [Han G.]Xidian University, School of Microelectronics, Xi'an, 710126, China

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Source :

IEEE Electron Device Letters

ISSN: 0741-3106

Year: 2023

Issue: 12

Volume: 44

Page: 2063-2066

4 . 1

JCR@2023

4 . 1 0 0

JCR@2023

JCR Journal Grade:2

CAS Journal Grade:2

Cited Count:

WoS CC Cited Count:

SCOPUS Cited Count:

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 0

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