Research on the reliability of Micro LED high-density solder joints under thermal cycling conditions - Details

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Abstract：

For　the　purpose　of　studying　the　effect　of　high-density,　small-size　solder　joints　on　the　thermal　fatigue　life　of　display　devices,　a　3D　model　of　the　corresponding　device　structure　is　established,　using　finite　element　analysis　methods,　and　using　Anand　constitutive　equations　and　Coffin-Manson　life　prediction　models.　The　equivalent　stress　and　strain　change　law　of　an　indium　solder　joint　with　a　diameter　of　10　μm　under　thermal　cycling　loading　conditions　is　explored,　and　the　key　position　of　the　solder　joint　damage　is　inferred　based　on　the　simulated　strain　cloud　diagram.　In　addition,　the　influence　of　different　bump　height,　bump　contact　area　and　Under-Bump　Metallization　(UBM)　thickness　on　the　thermal　fatigue　life　of　solder　joints　is　studied　separately.　The　final　simulation　results　show　that　the　location　where　the　solder　joint　may　be　damaged　first　is　at　the　point　on　the　outer　side　where　the　solder　joint　is　connected　to　the　UBM　on　the　edge　away　from　the　center　point.　The　height　of　the　bump　and　the　contact　area　of　the　bump　have　a　significant　effect　on　its　thermal　fatigue　life.　In　the　actual　experiment,　we　should　focus　on　the　impact　of　this　aspect.　©　Published　under　licence　by　IOP　Publishing　Ltd.

Keyword：

Constitutive equations Display devices Light emitting diodes Stress analysis Thermal cycling Thermal fatigue

Community：

[ 1 ] [Liu, Mingyang]National and Local United Engineering Laboratory of Flat Panel Display Technology, College of Physics and Information Engineering, Fuzhou University, Fuzhou; 350108, China
[ 2 ] [Nie, Junyang]Faculty of Electronic and Information Engineering, Xi'An Jiaotong University, Xi'an; 710049, China
[ 3 ] [Liu, Yifeng]National and Local United Engineering Laboratory of Flat Panel Display Technology, College of Physics and Information Engineering, Fuzhou University, Fuzhou; 350108, China
[ 4 ] [Sun, Jie]National and Local United Engineering Laboratory of Flat Panel Display Technology, College of Physics and Information Engineering, Fuzhou University, Fuzhou; 350108, China
[ 5 ] [Li, Min]Fujian Science & Technology Innovation Laboratory for Optoelectronic Information of China, Fuzhou; 350116, China
[ 6 ] [Yan, Chunli]Department of Information and Automation, Library of Fuzhou University, Fuzhou; 350116, China
[ 7 ] [Yan, Qun]National and Local United Engineering Laboratory of Flat Panel Display Technology, College of Physics and Information Engineering, Fuzhou University, Fuzhou; 350108, China