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author:

Zhang, Weiying (Zhang, Weiying.) [1] | Yun, Mengying (Yun, Mengying.) [2] | Yu, Zhenlin (Yu, Zhenlin.) [3] | Chen, Dan (Chen, Dan.) [4] | Li, Xiao (Li, Xiao.) [5]

Indexed by:

EI

Abstract:

A novel Cu(II) ion-imprinted complex adsorbent [Cu(II)-IIP] from alginate and chitosan was prepared by a three-step process of beading–combining–crosslinking with Cu2+ as the template ion. The Cu(II)-IIP showed higher capacity and selectivity for Cu(II) than the non-imprinted polymer. The theoretical maximum adsorption capacity of Cu(II)-IIP reached 83.33 mg/g, and the separation factor (α) for Cu(II) versus Zn(II) was 2.28. The adsorption of Cu2+ onto the Cu(II)-IIP was perfectly described by the Langmuir isotherm model. The adsorption kinetics agreed with the pseudo-first-order model in the first 8 h and more fitted pseudo-second-order model after then. Weber–Morris model confirmed that the adsorption rate would be controlled dominantly by the intraparticle diffusion and the inner surface binding. Moreover, the Cu(II)-IIP complex adsorbent exhibited good regeneration, and the adsorption capacity was stable within the first three adsorption–desorption cycles without significant reduction. © 2018, Springer-Verlag GmbH Germany, part of Springer Nature.

Keyword:

Adsorption Alginate Chitosan Copper compounds Ions Isotherms Zinc compounds

Community:

  • [ 1 ] [Zhang, Weiying]College of Chemical Engineering, Fuzhou University, Fuzhou; 350108, China
  • [ 2 ] [Yun, Mengying]College of Chemical Engineering, Fuzhou University, Fuzhou; 350108, China
  • [ 3 ] [Yu, Zhenlin]College of Chemical Engineering, Fuzhou University, Fuzhou; 350108, China
  • [ 4 ] [Chen, Dan]College of Chemical Engineering, Fuzhou University, Fuzhou; 350108, China
  • [ 5 ] [Li, Xiao]College of Chemical Engineering, Fuzhou University, Fuzhou; 350108, China

Reprint 's Address:

  • [li, xiao]college of chemical engineering, fuzhou university, fuzhou; 350108, china

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Source :

Polymer Bulletin

ISSN: 0170-0839

Year: 2019

Issue: 4

Volume: 76

Page: 1861-1876

2 . 0 1 4

JCR@2019

3 . 1 0 0

JCR@2023

ESI HC Threshold:184

JCR Journal Grade:2

CAS Journal Grade:4

Cited Count:

WoS CC Cited Count: 0

SCOPUS Cited Count: 35

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 4

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