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author:

Wang, Yue M. (Wang, Yue M..) [1] | Weng, Wei X. (Weng, Wei X..) [2] | Chi, Ming H. (Chi, Ming H..) [3] | Liu, Bai L. (Liu, Bai L..) [4] | Li, Qiang (Li, Qiang.) [5]

Indexed by:

EI

Abstract:

Thermal barrier coating is a high-temperature protective technology widely used in industrial gas turbines. However, the failure of coating peeling because of the generation of thermally grown oxide (TGO) at the interface during service hinders its further application. In this study, Raman spectroscopy and wedge indentation are used to determine the TGO residual stress and the interface energy release rate, respectively. The effect of TGO on the interfacial fracture toughness during the growth process was discussed. Raman spectroscopy test results show that the residual stress of TGO is about 0.5 GPa. Wedge indentation test results illustrate that high-temperature heat treatment could accelerate the interface degradation of thermal barrier coatings. Stress analysis and test research demonstrate that the microcracks induced by compressive stress of TGO will propagate with increasing heating time, ending with failure of barrier coatings. © 2020 Materials Research Society.

Keyword:

Compressive stress Fracture toughness Indentation Microcracks Raman spectroscopy Residual stresses Stress analysis Thermal barrier coatings

Community:

  • [ 1 ] [Wang, Yue M.]School of Materials Science and Engineering, Fuzhou University, Fuzhou; 350116, China
  • [ 2 ] [Weng, Wei X.]School of Materials Science and Engineering, Fuzhou University, Fuzhou; 350116, China
  • [ 3 ] [Chi, Ming H.]School of Materials Science and Engineering, Fuzhou University, Fuzhou; 350116, China
  • [ 4 ] [Liu, Bai L.]School of Materials Science and Engineering, Fuzhou University, Fuzhou; 350116, China
  • [ 5 ] [Li, Qiang]School of Materials Science and Engineering, Fuzhou University, Fuzhou; 350116, China

Reprint 's Address:

  • [li, qiang]school of materials science and engineering, fuzhou university, fuzhou; 350116, china

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Source :

Journal of Materials Research

ISSN: 0884-2914

Year: 2020

Issue: 13

Volume: 35

Page: 1715-1725

2 . 7 0 0

JCR@2023

ESI HC Threshold:196

JCR Journal Grade:3

CAS Journal Grade:4

Cited Count:

WoS CC Cited Count: 0

SCOPUS Cited Count: 3

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 0

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