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author:

Wu, Hanqun (Wu, Hanqun.) [1] | Deng, Liping (Deng, Liping.) [2] (Scholars:邓丽萍) | Pan, Xincheng (Pan, Xincheng.) [3] | Wang, Bingshu (Wang, Bingshu.) [4] (Scholars:汪炳叔) | Xiang, Hongliang (Xiang, Hongliang.) [5] (Scholars:向红亮)

Indexed by:

EI Scopus SCIE

Abstract:

The laminated carbon-nanotubes/Cu (CNTs/Cu) composites were fabricated by electrophoretic deposition (EPD), spark plasma sintering (SPS), and hot rolling to achieve a good combination of properties. The microstructure, mechanical properties, and electrical conductivity were investigated, and the strengthening mechanism was discussed. Results indicated that functional groups were introduced onto the surface of CNTs after acid treatment, enabling the formation of an optimal CNT deposition morphology on the Cu matrix at an electrophoretic deposition voltage of 75 V. The sintered CNTs/Cu composite exhibits a laminated structure with coarse grains and randomly distributed textures. Compared to sintered pure Cu, the sintered composite demonstrates a 42.07 % increase in tensile strength and a 17.8 % improvement in elongation. And the electrical conductivity reaches 93.05 % of the International Annealed Copper Standard (IACS). Subsequent hot rolling refined the grains and reoriented the texture to deformation textures. The hot-rolled composites achieve a tensile strength of 355 MPa, an elongation of 12.2 %, and a conductivity of 85.53 % IACS. The strengthening mechanisms of CNTs/Cu composites involve grain refinement, load transfer, and thermal mismatch strengthening, with grain refinement as the primary factor. Grain refinement, crack deflection, and bridging-pullout of CNTs are mainly responsible for the good combination of strength, ductility and electrical conductivity.

Keyword:

Carbon-nanotubes/Cu composites Electrophoretic deposition Laminated structure Microstructure Strengthening

Community:

  • [ 1 ] [Wu, Hanqun]Fuzhou Univ, Sch Mech Engn & Automat, Fuzhou 350116, Peoples R China
  • [ 2 ] [Deng, Liping]Fuzhou Univ, Sch Mech Engn & Automat, Fuzhou 350116, Peoples R China
  • [ 3 ] [Pan, Xincheng]Fuzhou Univ, Sch Mech Engn & Automat, Fuzhou 350116, Peoples R China
  • [ 4 ] [Xiang, Hongliang]Fuzhou Univ, Sch Mech Engn & Automat, Fuzhou 350116, Peoples R China
  • [ 5 ] [Wang, Bingshu]Fuzhou Univ, Coll Mat Sci & Engn, Fuzhou 350108, Fujian, Peoples R China

Reprint 's Address:

  • 邓丽萍 汪炳叔

    [Deng, Liping]Fuzhou Univ, Sch Mech Engn & Automat, Fuzhou 350116, Peoples R China;;[Wang, Bingshu]Fuzhou Univ, Coll Mat Sci & Engn, Fuzhou 350108, Fujian, Peoples R China

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Source :

MATERIALS CHARACTERIZATION

ISSN: 1044-5803

Year: 2025

Volume: 221

4 . 8 0 0

JCR@2023

Cited Count:

WoS CC Cited Count:

SCOPUS Cited Count:

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 1

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