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author:

Zhao, Guangen (Zhao, Guangen.) [1] | Huang, Yuhua (Huang, Yuhua.) [2] | Zhang, Wenwei (Zhang, Wenwei.) [3] | Wang, Chengxin (Wang, Chengxin.) [4] | Chen, Jianxiong (Chen, Jianxiong.) [5]

Indexed by:

EI

Abstract:

High-precision eddy current sensors for displacement and thickness measurement play a crucial role in vital fields such as semiconductor manufacturing, precision optics, and aerospace. As precision manufacturing advances towards digitalization and intelligence, the performance and functionality of these sensors face increasingly stringent demands. In this review, the analytical and equivalent circuit model of eddy current detection are analyzed from the basic structure and working principle, obtaining the application branch of displacement and thickness measurement. The optimization of configuration, signal processing circuitry, and temperature compensation technology is reviewed for the improvement of core performance indicators such as range, resolution, and thermal stability. The challenges faced in practical applications, including the suppression of lift-off effect, multilayer film thickness measurement and edge detection, are identified. Finally, the development direction of eddy current displacement and thickness sensors is envisioned. © 2024 Elsevier Ltd

Keyword:

Displacement measurement Eddy current testing Multilayer films Semiconductor device manufacture Thickness gages Thickness measurement

Community:

  • [ 1 ] [Zhao, Guangen]School of Mechanical Engineering and Automation, Fuzhou University, Fuzhou; 350118, China
  • [ 2 ] [Huang, Yuhua]School of Mechanical Engineering and Automation, Fuzhou University, Fuzhou; 350118, China
  • [ 3 ] [Zhang, Wenwei]School of Mechanical Engineering and Automation, Fuzhou University, Fuzhou; 350118, China
  • [ 4 ] [Wang, Chengxin]School of Mechanical Engineering and Automation, Fuzhou University, Fuzhou; 350118, China
  • [ 5 ] [Chen, Jianxiong]School of Mechanical Engineering and Automation, Fuzhou University, Fuzhou; 350118, China

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Source :

Measurement: Journal of the International Measurement Confederation

ISSN: 0263-2241

Year: 2025

Volume: 243

5 . 2 0 0

JCR@2023

Cited Count:

WoS CC Cited Count:

SCOPUS Cited Count:

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 2

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