In　this　paper,　the　effects　of　Hf　addition　on　the　mechanical　properties,　electrical　conductivity　and　microstructure　of　Cu-Sn-P　alloy　were　investigated.　The　results　show　that　the　Hf　addition　can　enhance　the　mechanical　properties　and　electrical　conductivity　of　Cu-Sn-P　alloy.　The　alloy　with　0.05　wt%　Hf　exhibits　the　best　comprehensive　performance　with　yield　strength　of　625　MPa,　tensile　strength　of　661　MPa　and　electrical　conductivity　of　16.8　%IACS.　Compared　with　the　Cu-Sn-P　alloy　without　Hf　addition,　the　yield　strength　and　tensile　strength　are　increased　by　8.4%　and　7.8%,　and　the　electrical　conductivity　is　increased　by　24.4%.　The　increase　in　the　strength　of　Hf-added　alloy　can　be　attributed　to　the　synergistic　effect　of　multiple　strengthening　mechanisms,　including　fine　grain　strengthening,　twin　strengthening,　dislocation　strengthening,　precipitation　strengthening　and　Sigma　3n　(n　=　1,　2,　3)　grain　boundary　strengthening.　Moreover,　the　Hf-P　precipitates　can　be　observed　in　the　Hf-added　alloy.　According　to　the　amount　of　Hf　addition,　these　precipitates　can　manifest　as　the　fine　HfP2　phase　and　the　coarse　HfP　phase.　The　formation　of　Hf-P　precipitates　contributes　to　the　precipitation　strengthening　and　the　purification　of　Cu　matrix,　thus　contributing　to　the　improvement　of　strength　and　conductivity.