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author:

Ni, Z. (Ni, Z..) [1] | Yu, J. (Yu, J..) [2] | Chen, G. (Chen, G..) [3] | Ji, M. (Ji, M..) [4] | Qian, S. (Qian, S..) [5] | Bian, D. (Bian, D..) [6] | Liu, M. (Liu, M..) [7] (Scholars:刘明)

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Scopus

Abstract:

ScAlMgO4 (SCAM), which can be used as an epitaxial substrate material of GaN in power devices, faces the challenge of achieving a high-quality surface by ultra-precision polishing due to its brittle and easily cleaved characteristics, which are closely associated with its mechanical properties. The micromechanical properties of SCAM single crystals were evaluated by nanoindentation and microscratch tests using different indenters. The elastic modulus EIT and the indentation hardness HIT of SCAM obtained by nanoindentation were 226 GPa and 12.1 GPa, respectively. Leaf-shaped chips and the associated step-like planes of SCAM can be found in the severely damaged regime during scratching by Berkovich and Vickers indenters with sharp edges due to the intersection of intense radial and lateral cracks. The fracture toughness (Kc = 1.12 MPa·m1/2) of SCAM can be obtained by using a scratch-based methodology for a spherical indenter based on linear elastic fracture mechanics (LEFM) under an appropriate range of applied loads. An optimal expression for calculating the fracture toughness of easily cleaved materials, including SCAM, via the Vickers indenter-induced cracking method using a Berkovich indenter was recommended. © 2024 by the authors.

Keyword:

fracture toughness micromechanical properties microscratch nanoindentation ScAlMgO4 single crystal

Community:

  • [ 1 ] [Ni Z.]School of Mechanical Engineering, Jiangnan University, Wuxi, 214122, China
  • [ 2 ] [Ni Z.]Jiangsu Province Engineering Research Center of Micro-Nano Additive and Subtractive Manufacturing, Wuxi, 214122, China
  • [ 3 ] [Yu J.]School of Mechanical Engineering, Jiangnan University, Wuxi, 214122, China
  • [ 4 ] [Chen G.]School of Electromechanical, Wuxi Vocational Institute of Commerce, Wuxi, 214153, China
  • [ 5 ] [Ji M.]School of Mechanical Engineering, Jiangnan University, Wuxi, 214122, China
  • [ 6 ] [Qian S.]School of Mechanical Engineering, Jiangnan University, Wuxi, 214122, China
  • [ 7 ] [Bian D.]School of Mechanical Engineering, Jiangnan University, Wuxi, 214122, China
  • [ 8 ] [Liu M.]Fujian Provincial Key Laboratory of Terahertz Functional Devices and Intelligent Sensing, School of Mechanical Engineering and Automation, Fuzhou University, Fuzhou, 350108, China

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Source :

Materials

ISSN: 1996-1944

Year: 2024

Issue: 15

Volume: 17

3 . 1 0 0

JCR@2023

Cited Count:

WoS CC Cited Count:

SCOPUS Cited Count: 1

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 3

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