Polyimide　(PI)　is　widely　used　as　a　mainstream　antenna　material　for　fourth-generation　communication　technology　(4G)　due　to　its　excellent　dielectric　properties　and　mechanical　properties.　However,　the　relatively　high　dielectric　constant　and　dielectric　loss　make　traditional　polyimide　unable　to　meet　the　requirement　of　the　fifth-generation　communication　technology.　The　molecular　engineering　strategy　is　an　effective　method　to　improve　the　dielec-tric　properties　and　control　the　comprehensive　performance　of　the　polyimide.　In　this　work,　an　m-phenylenedi-amine　containing　tetrafluorostyrol　pendant　group　[(4-(2,3,5,6-tetrafluoro-4-vinylphenoxy)　benzene-1,3-diamine　(TFVPDM)]　has　been　designed.　On　the　one　hand,　the　rigid　m-phenylene　and　biphenyl　structure　in　TFVPDM　is　beneficial　for　balancing　the　solubility　and　thermal　properties　of　the　TFVPDM-based　polyimides.　On　the　other　hand,　the　tetrafluorostyrol　pendant　group　can　provide　cross-linkable　sites　and　help　construct　the　hydrophobic　network　in　the　TFVPDM-based　cross-linked　fluorinated　polyimides　(CL-FPIs:　CL-FPI-10;　CL-FPI-20;　CL-FPI-30),　which　can　improve　their　dielectric　properties　and　water　resistance.　The　CL-FPIs　films　were　obtained　through　polymerization　of　TFVPDM,　2,2　＇-bis(trifluoromethyl)　benzidine　(TFDB),　and　4,4　＇-(hexafluoroisopropylidene)　diphthalic　anhydride　(6FDA),　and　subsequent　cross-linking　reaction.　Among　CL-FPIs,　the　CL-FPI-30　shows　the　best　comprehensive　performance　including　low　dielectric　constant　(2.29　at　room　temperature　and　2.03　at　200　degrees　C),　low　dielectric　loss　(0.0051　at　1　MHz),　high　glass　transition　temperature　(Tg)　(346.9　degrees　C),　low　coefficient　of　thermal　expansion　(CTE)　(44.1　ppm　degrees　C-　1),　low　water　absorption　(0.128%)　and　good　stability　of　dielectric　constant　in　a　humid　environment.