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author:

Liu, M. (Liu, M..) [1] (Scholars:刘明) | Xu, Z. (Xu, Z..) [2] | Yang, F. (Yang, F..) [3]

Indexed by:

Scopus PKU CSCD

Abstract:

Dynamic behavior under cyclic loading conditions and creep behavior under quasi-static loading conditions were investigated by instrumented indentation of pure aluminum to reveal the influence of loading conditions (e.g., load, loading rate, and holding time) on indentation responses. The results of cyclic indentation show that, with the increase in the holding time, load, and loading rate of the pre-cyclic loading segment, the effect of creep on the subsequent cyclic indentation can be weakened, and the measured mechanical properties (e.g., contact depth, indentation hardness, and elastic modulus) can reach constant levels more rapidly with the increase in cycle number. The results of the creep tests show that the elastic modulus and indentation hardness decrease with the increase in holding time, the steady-state creep stress exponent obtained by instrumented indentation is independent of load, and a long holding time is not suggested for the creep tests. Indentation hardness and steady-state creep resistance measured within the inner grains are higher than those measured near the grain boundary regions. © 2023 Chinese Academy of Sciences. All rights reserved.

Keyword:

creep cyclic indentation instrumented indentation loading conditions pure aluminum

Community:

  • [ 1 ] [Liu, M.]Fujian Provincial Key Laboratory of Terahertz Functional Devices and Intelligent Sensing, School of Mechanical Engineering and Automation, Fuzhou University, Fuzhou, 350116, China
  • [ 2 ] [Xu, Z.]Fujian Provincial Key Laboratory of Terahertz Functional Devices and Intelligent Sensing, School of Mechanical Engineering and Automation, Fuzhou University, Fuzhou, 350116, China
  • [ 3 ] [Yang, F.]Department of Chemical and Materials Engineering, University of Kentucky, Lexington, 40506, United States

Reprint 's Address:

  • 刘明

    [Liu, M.]Fujian Provincial Key Laboratory of Terahertz Functional Devices and Intelligent Sensing, China;;[Yang, F.]Department of Chemical and Materials Engineering, United States

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Source :

Scientia Sinica: Physica, Mechanica et Astronomica

ISSN: 1674-7275

Year: 2023

Issue: 1

Volume: 53

0 . 5

JCR@2023

0 . 5 0 0

JCR@2023

JCR Journal Grade:4

CAS Journal Grade:4

Cited Count:

WoS CC Cited Count: 0

SCOPUS Cited Count: 1

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 2

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