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[期刊论文]

An improved thermal model for the orthogonal cutting considering non-uniform heat partition of shear heat source

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author:

Ding, Y. (Ding, Y..) [1] | Yu, J. (Yu, J..) [2]

Indexed by:

Scopus

Abstract:

Temperature distribution and heat partition have a significant impact on tool life and machined surface integrity in metal cutting process. In this work, the concept of non-uniform heat partition of the shear heat source on the shear plane was proposed, and an improved cutting thermal model was proposed based on this concept. The improved thermal model had a continuous temperature field at the shear plane compared with the previous thermal model. Comparing the thermal model before and after improvement with the finite element model (FEM), it was found that the temperature distribution of the improved thermal model was closer to the FEM. In addition, a calculation method for the heat partition coefficient of the shear heat source considering mass transfer and the ratio of the heat flow entering workpiece, chip and tool to the total heat generated during the cutting process were proposed based on the improved thermal model. The results were compared with the regression models proposed before, and showed that the shear angle is an indispensable factor for analyzing the heat flow in the cutting process when the thermophysical properties of workpiece remain unchanged. © 2023 Elsevier Masson SAS

Keyword:

Heat flow Metal cutting Non-uniform heat partition Temperature field

Community:

  • [ 1 ] [Ding, Y.]School of Mechanical Engineering and Automation, Fuzhou University, Fuzhou, 350116, China
  • [ 2 ] [Yu, J.]School of Mechanical Engineering and Automation, Fuzhou University, Fuzhou, 350116, China

Reprint 's Address:

  • [Yu, J.]Department of Mechanical and Electrical Engineering, China

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Source :

International Journal of Thermal Sciences

ISSN: 1290-0729

Year: 2023

Volume: 190

4 . 9

JCR@2023

4 . 9 0 0

JCR@2023

ESI HC Threshold:35

JCR Journal Grade:1

CAS Journal Grade:2

Cited Count:

WoS CC Cited Count:

SCOPUS Cited Count: 4

30 Days PV: 6

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