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author:

王显彬 (王显彬.) [1] | 谢华 (谢华.) [2] (Scholars:谢华)

Indexed by:

CQVIP CSCD

Abstract:

采用薄片弯曲法测量不同pH值和不同热处理对化学镀镍层内应力的影响,分析了产生变化的原因.结果表明,当镀液pH值为3.8~4.1和4.4~4.6时,镀层受到的内应力为压应力,而当镀液pH值为4.8~5.1时,镀层受到的内应力为拉应力.镀液pH值越高,镀层中磷含量越低,其内应力越高.经过200℃×1 h热处理,镀层的内应力减小;经过400℃×1 h或600℃×1 h热处理,镀层的内应力增大.

Keyword:

内应力 化学镀镍 薄片弯曲法

Community:

  • [ 1 ] [王显彬]福州大学
  • [ 2 ] [谢华]福州大学

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Source :

电镀与环保

ISSN: 1000-4742

CN: 31-1507/X

Year: 2006

Issue: 3

Volume: 26

Page: 25-27

Cited Count:

WoS CC Cited Count: 0

SCOPUS Cited Count:

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 5

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