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author:

Zhang, GS (Zhang, GS.) [1] | Lin, J (Lin, J.) [2] | Chen, W (Chen, W.) [3] (Scholars:陈为)

Indexed by:

CPCI-S

Abstract:

Based on previous studies about the contact resistance model and the conductive paste, the contact resistance model for the busbar joints lubricated by contact aid compounds is formed. The relation between the contact aid compound's technical parameters and the contact spot's microscopic parameters is established. Using this model, the numerical calculation and analysis to the contact spot's microscopic parameters and the electrical contact properties are made, and some results are obtained. The computer simulation of the electrical contact phenomena is realized initially under lubricated and un-lubricated case.

Keyword:

busbar contact aid compound contact resistance electrical contact joint model numerical calculation simulation temperature-rise

Community:

  • [ 1 ] Fuzhou Univ, Fujian, Peoples R China

Reprint 's Address:

  • 张冠生

    [Zhang, GS]Fuzhou Univ, Fujian, Peoples R China

Email:

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Source :

ELECTRICAL CONTACTS - 1998

Year: 1998

Page: 172-178

Language: English

Cited Count:

WoS CC Cited Count: 0

SCOPUS Cited Count:

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 12

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