This　research　study　investigates　the　hole　metallisation　processes　of　the　microwave　printed　circuit　board.　During　the　study,　the　poly(tetrafluoroethylene)　(PTFE)　wall　of　the　holes　was　modified　by　sodium　naphthalene　solution.　Owing　to　the　disruption　of　the　C-F　bond　by　the　sodium　atoms　on　the　PTFE　surface　transforming　C-　dangling　bonds,　the　surface　energy　of　the　PTFE　increased　from　about　20　to　60-70　mN　cm(-1).　The　study　employed　XPS　analysis　to　examine　the　modification　mechanism.　The　results　of　the　authors＇　study　show　peel　strength　of　similar　to　2.03　N　cm(-1)　between　the　copper　layer　and　the　sample　treated　with　sodium　naphthalene　solution　within　the　time　range　of　20-30　s.