Ultrafine　grained　nickel　(UFG　Ni)　and　microcrystalline　nickel　(MC　Ni)　were　fabricated　on　two　types　of　substrates,　i.e.　the　amorphous　(Ni-P)　and　polycrystalline　(stainless　steel)　substrates　by　pulse　electrodeposition　without　additives.　This　study　demonstrates　that　when　inhibiting　the　epitaxial　growth　by　first　depositing　a　thin　amorphous　layer　on　the　polycrystalline　substrates,　the　grain　size　of　the　subsequent　Ni　deposit　decreases　dramatically　from　microscale　to　the　UFG　regime,　which　depends　on　the　deposition　conditions.　Compared　with　MC　Ni,　which　has　an　ultimate　tensile　strength　sigma(UTS)　of　397　MPa　and　an　elongation　to　failure　epsilon(TEF)　of　11.98%,　UFG　Ni　with　an　average　grain　size　of　120.72　nm　exhibits　an　enhanced　sigma(UTS)　of　807　MPa　and　a　comparable　epsilon(TEF)　of　10.44%.　The　electrodeposited　method　used　in　this　study　provides　an　effective　and　low　cost　way　to　produce　UFG　materials　with　both　high　strength　and　ductility,　which　can　meet　the　demands　for　practical　application　as　structural　materials.