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author:

Mikami, Clarisse (Mikami, Clarisse.) [1] | Wu, Hwai-Chung (Wu, Hwai-Chung.) [2] | Elarbi, Abulgasem (Elarbi, Abulgasem.) [3]

Indexed by:

EI Scopus SCIE

Abstract:

In recent years, thin fiber reinforced polymer (FRP) composite sheets have been successfully used in strengthening deficient concrete structures. Although the short term performance of these FRP sheets has been satisfactory, their long term durability performance remains yet to be confirmed. The bond strength between FRP and its concrete substrate is one of the critical design factors due to the composite action requirement. In this paper, the effects of hot temperature (100 and 180 degrees C) on the deterioration of bond strength and the changes in failure modes are presented and discussed. Three possible failure modes are considered in this study: cohesive in the concrete substrate, mixed, and adhesive at the interface. Therefore, the true bond strength between concrete and FRP can only be measured when the failure mode is adhesive. Under the control conditions at room temperature, the true adhesive strength exceeds 6 MPa, which is adequate for most engineering applications. A combination of high temperature and low humidity is the most detrimental to bond strength. (C) 2015 Elsevier Ltd. All rights reserved.

Keyword:

Adhesive failure Bond strength Cohesive failure Concrete FRP High temperature Strengthening

Community:

  • [ 1 ] [Mikami, Clarisse]Wayne State Univ, Dept Civil & Environm Engn, Detroit, MI 48202 USA
  • [ 2 ] [Wu, Hwai-Chung]Wayne State Univ, Dept Civil & Environm Engn, Detroit, MI 48202 USA
  • [ 3 ] [Elarbi, Abulgasem]Wayne State Univ, Dept Civil & Environm Engn, Detroit, MI 48202 USA
  • [ 4 ] [Wu, Hwai-Chung]Fuzhou Univ, Coll Civil Engn, Fuzhou 350108, Peoples R China

Reprint 's Address:

  • 吴怀中

    [Wu, Hwai-Chung]Wayne State Univ, 5050 Anthony Wayne Dr, Detroit, MI 48202 USA

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Source :

CONSTRUCTION AND BUILDING MATERIALS

ISSN: 0950-0618

Year: 2015

Volume: 91

Page: 180-186

2 . 4 2 1

JCR@2015

7 . 4 0 0

JCR@2023

ESI Discipline: MATERIALS SCIENCE;

ESI HC Threshold:335

JCR Journal Grade:1

CAS Journal Grade:2

Cited Count:

WoS CC Cited Count: 40

SCOPUS Cited Count: 44

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 3

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