Thermal stability of Cu-Nb microcomposite wires (vol 101, pg 181, 2015) - Details

author：

Deng, Liping (Deng, Liping.) ^[1] (Scholars：邓丽萍) | Han, Ke (Han, Ke.) ^[2] | Wang, Bingshu (Wang, Bingshu.) ^[3] (Scholars：汪炳叔) | Yang, Xiaofang (Yang, Xiaofang.) ^[4] | Liu, Qing (Liu, Qing.) ^[5]

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[ 1 ] [Deng, Liping]Fuzhou Univ, Sch Mech Engn & Automat, Fuzhou 350116, Peoples R China
[ 2 ] [Wang, Bingshu]Fuzhou Univ, Sch Mech Engn & Automat, Fuzhou 350116, Peoples R China
[ 3 ] [Han, Ke]Natl High Magnet Field Lab, Tallahassee, FL 32310 USA
[ 4 ] [Deng, Liping]Chongqing Univ, Coll Mat Sci & Engn, Chongqing 400044, Peoples R China
[ 5 ] [Wang, Bingshu]Chongqing Univ, Coll Mat Sci & Engn, Chongqing 400044, Peoples R China
[ 6 ] [Yang, Xiaofang]Chongqing Univ, Coll Mat Sci & Engn, Chongqing 400044, Peoples R China
[ 7 ] [Liu, Qing]Chongqing Univ, Coll Mat Sci & Engn, Chongqing 400044, Peoples R China

Reprint 's Address：

邓丽萍
[Deng, Liping]Fuzhou Univ, Sch Mech Engn & Automat, Fuzhou 350116, Peoples R China

Email：

ldeng@fzu.edu.cn

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Erratum: Thermal stability of Cu-Nb microcomposite wires (Acta Materialia (2015) 101 (181-188))
2016，Acta Materialia

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Source ：

ACTA MATERIALIA

ISSN： 1359-6454

Year： 2016

Volume： 105

Page： 519-519

5 . 3 0 1

JCR@2016

8 . 3 0 0

JCR@2023

ESI Discipline： MATERIALS SCIENCE;

ESI HC Threshold：324

JCR Journal Grade：1

CAS Journal Grade：1

Cited Count：

WoS CC Cited Count： 1

SCOPUS Cited Count： 1

ESI Highly Cited Papers on the List： 0 Unfold All

WanFang Cited Count：

Chinese Cited Count：

30 Days PV： 5

Affiliated Colleges：

机械工程及自动化学院本学院/部未明确归属的数据

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