Erratum: Thermal stability of Cu-Nb microcomposite wires (Acta Materialia (2015) 101 (181-188)) - Details

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Deng, L. (Deng, L..) ^[1] | Han, K. (Han, K..) ^[2] | Wang, B. (Wang, B..) ^[3] | Yang, X. (Yang, X..) ^[4] | Liu, Q. (Liu, Q..) ^[5]

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[ 1 ] [Deng, L.]School of Mechanical Engineering and Automation, Fuzhou University, Fuzhou, 350116, China
[ 2 ] [Deng, L.]College of Materials Science and Engineering, Chongqing University, Chongqing, 400044, China
[ 3 ] [Han, K.]National High Magnetic Field Laboratory, Tallahassee, FL 32310, United States
[ 4 ] [Wang, B.]School of Mechanical Engineering and Automation, Fuzhou University, Fuzhou, 350116, China
[ 5 ] [Wang, B.]College of Materials Science and Engineering, Chongqing University, Chongqing, 400044, China
[ 6 ] [Yang, X.]College of Materials Science and Engineering, Chongqing University, Chongqing, 400044, China
[ 7 ] [Liu, Q.]College of Materials Science and Engineering, Chongqing University, Chongqing, 400044, China

Reprint 's Address：

[Deng, L.]School of Mechanical Engineering and Automation, Fuzhou UniversityChina

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ldeng@fzu.edu.cn

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ISSN： 1359-6454

Year： 2016

Volume： 105

Page： 519-

Language： English

5 . 3 0 1

JCR@2016

8 . 3 0 0

JCR@2023

ESI HC Threshold：324

JCR Journal Grade：1

CAS Journal Grade：1

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WoS CC Cited Count： 0

SCOPUS Cited Count： 1

ESI Highly Cited Papers on the List： 0 Unfold All

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30 Days PV： 4

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