Effects of interface area density and solid solution on the microhardness of Cu-Nb microcomposite wires - Details

author：

Deng, Liping (Deng, Liping.) ^[1] (Scholars：邓丽萍) | Liu, Zhifeng (Liu, Zhifeng.) ^[2] | Wang, Bingshu (Wang, Bingshu.) ^[3] (Scholars：汪炳叔) | Han, Ke (Han, Ke.) ^[4] | Xiang, Hongliang (Xiang, Hongliang.) ^[5] (Scholars：向红亮)

Indexed by：

EI Scopus SCIE

Abstract：

Cu-Nb　microcomposite　wires　drawn　to　different　strain　values　were　studied　by　means　of　scanning　electron　microscopy　and　transmission　electron　microscopy.　The　Cu　and　Nb　near　the　interfaces　show　a　typical　Kurdjumov-Sachs　relationship　with　a　deviation　angle　of　12　degrees.　This　deviation　accommodates　internal　stresses　and　slip　discontinuity　between　Cu　and　Nb.　The　dislocations　are　mainly　stored　around　the　interface　near　the　Cu　matrix.　Lattice　distortion　occurred　near　the　interfaces,　where　Nb　is　believed　to　mix　into　Cu　matrix.　Microhardness　is　affected　by　interface　area　density　as　well　as　by　strain-induced　lattice　distortion,　which　can　produce　a　supersaturated　solid　solution.

Keyword：

Cu-Nb microcomposite wires Interface Microhardness Solid solution

Community：

[ 1 ] [Deng, Liping]Fuzhou Univ, Sch Mech Engn & Automat, Fuzhou 350116, Fujian, Peoples R China
[ 2 ] [Liu, Zhifeng]Fuzhou Univ, Sch Mech Engn & Automat, Fuzhou 350116, Fujian, Peoples R China
[ 3 ] [Xiang, Hongliang]Fuzhou Univ, Sch Mech Engn & Automat, Fuzhou 350116, Fujian, Peoples R China
[ 4 ] [Wang, Bingshu]Fuzhou Univ, Coll Mat Sci & Engn, Fuzhou 350116, Fujian, Peoples R China
[ 5 ] [Han, Ke]Natl High Magnet Field Lab, Tallahassee, FL 32310 USA

Reprint 's Address：

邓丽萍向红亮
[Deng, Liping]Fuzhou Univ, Sch Mech Engn & Automat, Fuzhou 350116, Fujian, Peoples R China;;[Xiang, Hongliang]Fuzhou Univ, Sch Mech Engn & Automat, Fuzhou 350116, Fujian, Peoples R China

Email：

ldeng@fzu.edu.cn |
xhl@fzu.edu.cn

Show more details

Version：