Cerium-lanthanum　mixed　rare　earth　(RE)　(0.5wt.%)　was　added　to　Zn-20Sn　high-temperature　lead-free　solder　to　study　the　effect　of　RE　on　the　solder　properties.　The　Zn-20Sn-0.5RE　solder　has　a　better　corrosion　resistance　than　that　of　Zn-20Sn　alloy.　RE　addition　increases　the　gamma-Cu5Zn8　layer　thickness,　promotes　growth　of　a　epsilon-CuZn5　layer　shaped　like　bamboo　shoots,　and　increases　the　roughness　of　the　epsilon-CuZn5　layer,　which　increases　the　shear　strength　of　the　solder　joints.　Compared　with　the　Zn-20Sn　alloy,　the　creep　resistance　of　the　Zn-20Sn-0.5RE　solder　was　improved　after　soldering.　The　indentation　hardness　increases　in　an　order　of　Zn-20Sn-0.5RE　solder,　Zn-20Sn　solder,　epsilon-CuZn5　layer,　and　gamma-Cu5Zn8　layer.