Effect of Rare Earth Metals on the Properties of Zn-20Sn High-Temperature Lead-Free Solder - Details

author：

Tian, J. (Tian, J..) ^[1] | Hong, C. (Hong, C..) ^[2] | Hong, L. (Hong, L..) ^[3] | Yan, X. (Yan, X..) ^[4] | Dai, P. (Dai, P..) ^[5]

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Scopus

Abstract：

Cerium–lanthanum　mixed　rare　earth　(RE)　(0.5 wt.%)　was　added　to　Zn-20Sn　high-temperature　lead-free　solder　to　study　the　effect　of　RE　on　the　solder　properties.　The　Zn-20Sn-0.5RE　solder　has　a　better　corrosion　resistance　than　that　of　Zn-20Sn　alloy.　RE　addition　increases　the　γ-Cu　5　Zn　8　layer　thickness,　promotes　growth　of　a　ε-CuZn　5　layer　shaped　like　bamboo　shoots,　and　increases　the　roughness　of　the　ε-CuZn　5　layer,　which　increases　the　shear　strength　of　the　solder　joints.　Compared　with　the　Zn-20Sn　alloy,　the　creep　resistance　of　the　Zn-20Sn-0.5RE　solder　was　improved　after　soldering.　The　indentation　hardness　increases　in　an　order　of　Zn-20Sn-0.5RE　solder,　Zn-20Sn　solder,　ε-CuZn　5　layer,　and　γ-Cu　5　Zn　8　layer.　©　2019,　The　Minerals,　Metals　&　Materials　Society.

Keyword：

corrosion resistance; high-temperature lead-free solder; interfacial reaction; nano-indentation; shear strength; Zn-20Sn alloy

Community：

[ 1 ] [Tian, J.]School of Materials Science and Engineering, Fuzhou University, Fuzhou, China
[ 2 ] [Tian, J.]School of Materials Science and Engineering, Fujian University of Technology, Fuzhou, China
[ 3 ] [Tian, J.]Fujian Provincial Key Laboratory of Advanced Materials Processing and Application, Fuzhou, China
[ 4 ] [Hong, C.]School of Materials Science and Engineering, Fujian University of Technology, Fuzhou, China
[ 5 ] [Hong, C.]Fujian Provincial Key Laboratory of Advanced Materials Processing and Application, Fuzhou, China
[ 6 ] [Hong, L.]School of Materials Science and Engineering, Fujian University of Technology, Fuzhou, China
[ 7 ] [Hong, L.]Fujian Provincial Key Laboratory of Advanced Materials Processing and Application, Fuzhou, China
[ 8 ] [Yan, X.]School of Materials Science and Engineering, Fujian University of Technology, Fuzhou, China
[ 9 ] [Yan, X.]Fujian Provincial Key Laboratory of Advanced Materials Processing and Application, Fuzhou, China
[ 10 ] [Dai, P.]School of Materials Science and Engineering, Fuzhou University, Fuzhou, China
[ 11 ] [Dai, P.]School of Materials Science and Engineering, Fujian University of Technology, Fuzhou, China
[ 12 ] [Dai, P.]Fujian Provincial Key Laboratory of Advanced Materials Processing and Application, Fuzhou, China

Reprint 's Address：

[Dai, P.]School of Materials Science and Engineering, Fujian University of TechnologyChina

Email：

pqdai@126.com

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Source ：

Journal of Electronic Materials

ISSN： 0361-5235

Year： 2019

Issue： 5

Volume： 48

Page： 2685-2690

1 . 7 7 4

JCR@2019

2 . 2 0 0

JCR@2023

ESI HC Threshold：236

JCR Journal Grade：3

CAS Journal Grade：4

Cited Count：

WoS CC Cited Count：

SCOPUS Cited Count： 4

ESI Highly Cited Papers on the List： 0 Unfold All

WanFang Cited Count：

Chinese Cited Count：

30 Days PV： 3

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