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author:

Zhang, Mingxue (Zhang, Mingxue.) [1] | Deng, Liping (Deng, Liping.) [2] (Scholars:邓丽萍) | Wang, Bingshu (Wang, Bingshu.) [3] (Scholars:汪炳叔) | Xiang, Hongliang (Xiang, Hongliang.) [4] (Scholars:向红亮)

Indexed by:

EI Scopus SCIE

Abstract:

The effect of torsional rate on the microstructure and texture of pure Cu at an equivalent strain of 3.94 was investigated by electron backscatter diffraction technique. The microstructure, texture evolutions and microhardness at different regions along radial directions were quantitatively analyzed. The results demonstrated that the grain size and microhardness reduced gradually along the radial direction, showing characteristics of gradient distribution. However, the torsional rate didn't show significant effect on them. The texture results showed that typical torsion textures developed during deformation. A/-A texture and B/-B texture were the major components in the center and 1/4 layer, and showed similar changes at different regions. While at the edge, C texture prevailed, and its strength increased as the torsional rate rose. The torsional rate, however, didn't show significant effect on the texture development of A/-A and B/-B textures as well.

Keyword:

Gradient microstructure Microhardness Pure copper Texture evolution Torsion rate

Community:

  • [ 1 ] [Zhang, Mingxue]Fuzhou Univ, Sch Mech Engn & Automat, Fuzhou 350116, Peoples R China
  • [ 2 ] [Deng, Liping]Fuzhou Univ, Sch Mech Engn & Automat, Fuzhou 350116, Peoples R China
  • [ 3 ] [Xiang, Hongliang]Fuzhou Univ, Sch Mech Engn & Automat, Fuzhou 350116, Peoples R China
  • [ 4 ] [Wang, Bingshu]Fuzhou Univ, Coll Adv Mfg, Jinjiang 362200, Peoples R China

Reprint 's Address:

  • 邓丽萍 向红亮

    [Deng, Liping]Fuzhou Univ, Sch Mech Engn & Automat, Fuzhou 350116, Peoples R China;;[Xiang, Hongliang]Fuzhou Univ, Sch Mech Engn & Automat, Fuzhou 350116, Peoples R China

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Source :

MATERIALS CHARACTERIZATION

ISSN: 1044-5803

Year: 2020

Volume: 161

4 . 3 4 2

JCR@2020

4 . 8 0 0

JCR@2023

ESI Discipline: MATERIALS SCIENCE;

ESI HC Threshold:196

JCR Journal Grade:1

CAS Journal Grade:1

Cited Count:

WoS CC Cited Count: 9

SCOPUS Cited Count: 5

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 1

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