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Silicone encapsulants with high thermal stability for SiC power devices under high temperatures SCIE
期刊论文 | 2025 , 36 (1) | JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
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Abstract :

Silicone carbide (SiC) electronic devices with high-power density put forward high temperature stability requirements for their insulation encapsulants. This work explores the thermal stability for three typical organic silicone encapsulant (SEMICOSIL 915HT, R-2188, Duraseal 1533) to obtain the suitable encapsulation materials in high temperatures. The results indicate that the reaction during the methyl oxidation stage of the thermal degradation process is similar to the initial reaction observed during the thermal oxidative aging process in silicone encapsulants. The activation energy for Duraseal 1533 for methyl oxidation reactions is relatively high. After 480 h of aging, for Duraseal 1533, the hardness changes least and the thermal expansion coefficient was the lowest with a change rate of only 0.07. It means that Duraseal 1533 is the suitable material for power devices under high temperatures. Our findings provide a preliminary method for assessing the long-tern thermal stability of silicone encapsulants and offers the guidance for selection of materials for high temperature SiC devices.

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GB/T 7714 Lin, Ying , Dong, Liye , Dang, Min et al. Silicone encapsulants with high thermal stability for SiC power devices under high temperatures [J]. | JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS , 2025 , 36 (1) .
MLA Lin, Ying et al. "Silicone encapsulants with high thermal stability for SiC power devices under high temperatures" . | JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS 36 . 1 (2025) .
APA Lin, Ying , Dong, Liye , Dang, Min , Li, Peixuan , Li, Mengying , Liu, Yuhao . Silicone encapsulants with high thermal stability for SiC power devices under high temperatures . | JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS , 2025 , 36 (1) .
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Silicone encapsulants with high thermal stability for SiC power devices under high temperatures Scopus
期刊论文 | 2025 , 36 (1) | Journal of Materials Science: Materials in Electronics
Silicone encapsulants with high thermal stability for SiC power devices under high temperatures EI
期刊论文 | 2025 , 36 (1) | Journal of Materials Science: Materials in Electronics
Coupling relationship between molecule structure at silica/silicone gel interfaces and ionic conductivity in polymer composites SCIE
期刊论文 | 2024 , 249 | COMPOSITES SCIENCE AND TECHNOLOGY
WoS CC Cited Count: 2
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Abstract :

Herein, the coupling relationship between molecule structure and ion conductivity in silica filled silicone gel are established. Based on the broadband dielectric spectrum, the concentration of ion charges and ions diffusion coefficients, two key roles for ion conductivity, are calculated. The concentration of ion charges is increased by about four orders of magnitude after the addition of silica. Because of the more short-length chains conformations and more amorphous regions at interfaces, the chains at interfaces are easier to rearrange with higher relaxation frequency, which enhances the ions diffusion process and contributes to negative decoupling exponents between the interface molecule relaxations and ion diffusion coefficients in silicone gel composites. With the increase of fumed silica loading, the ionic conductivity increases first and decreases owing to percolation phenomenon about silica dispersion. Meanwhile, decoupling exponents of the interface molecules are closer to 0. Our findings deepen the understanding how the interface structures act on ions conductivity in insulating polymer composites, which is critical to rationally design interface structures for manipulating the insulation performances.

Keyword :

Dielectricity Dielectricity Electrical properties Electrical properties Interface Interface Non-destructive testing Non-destructive testing Polymer -matrix composites (PMCs) Polymer -matrix composites (PMCs)

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GB/T 7714 Lin, Ying , Dong, Liye , Heng, Chuanle et al. Coupling relationship between molecule structure at silica/silicone gel interfaces and ionic conductivity in polymer composites [J]. | COMPOSITES SCIENCE AND TECHNOLOGY , 2024 , 249 .
MLA Lin, Ying et al. "Coupling relationship between molecule structure at silica/silicone gel interfaces and ionic conductivity in polymer composites" . | COMPOSITES SCIENCE AND TECHNOLOGY 249 (2024) .
APA Lin, Ying , Dong, Liye , Heng, Chuanle , Chen, Kai , Liu, Yuhao . Coupling relationship between molecule structure at silica/silicone gel interfaces and ionic conductivity in polymer composites . | COMPOSITES SCIENCE AND TECHNOLOGY , 2024 , 249 .
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Coupling relationship between molecule structure at silica/silicone gel interfaces and ionic conductivity in polymer composites EI
期刊论文 | 2024 , 249 | Composites Science and Technology
Coupling relationship between molecule structure at silica/silicone gel interfaces and ionic conductivity in polymer composites Scopus
期刊论文 | 2024 , 249 | Composites Science and Technology
Understanding Water Diffusion Behaviors in Epoxy Resin through Molecular Simulations and Experiments SCIE
期刊论文 | 2024 , 40 (9) , 4871-4880 | LANGMUIR
WoS CC Cited Count: 8
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Abstract :

The unclear understanding of the water diffusion behavior posts a big challenge to the manipulation of water absorption properties in epoxy resins. Herein, we investigated the water diffusion behavior and its relationship with molecule structures inside an epoxy resin mainly by the nonequilibrium molecular dynamics and experiments. It is found that at the initial rapid water absorption stage, bound water and free water both contribute, while at the later slow water absorption stage, free water plays a dominant role. The observed evolution of free water and bound water cannot be explained by the traditional Langmuir model. In addition, molecule polarity, free volume, and segment mobility can all influence the water diffusion process. Hence, the epoxy resin with low polarity and high molecular segment mobility is endowed with higher diffusion coefficients. The saturated water absorption content is almost dependent on the polarity. The understanding of how water diffuses and what decides the diffusion process is critical to the rational design of molecule structures for improving the water resistance in epoxy resin.

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GB/T 7714 Liu, Yuhao , Lin, Ying , Zhang, Yunxiao et al. Understanding Water Diffusion Behaviors in Epoxy Resin through Molecular Simulations and Experiments [J]. | LANGMUIR , 2024 , 40 (9) : 4871-4880 .
MLA Liu, Yuhao et al. "Understanding Water Diffusion Behaviors in Epoxy Resin through Molecular Simulations and Experiments" . | LANGMUIR 40 . 9 (2024) : 4871-4880 .
APA Liu, Yuhao , Lin, Ying , Zhang, Yunxiao , Cao, Bin , Wu, Kangning , Wang, Liming . Understanding Water Diffusion Behaviors in Epoxy Resin through Molecular Simulations and Experiments . | LANGMUIR , 2024 , 40 (9) , 4871-4880 .
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Understanding Water Diffusion Behaviors in Epoxy Resin through Molecular Simulations and Experiments Scopus
期刊论文 | 2024 , 40 (9) , 4871-4880 | Langmuir
Understanding Water Diffusion Behaviors in Epoxy Resin through Molecular Simulations and Experiments EI
期刊论文 | 2024 , 40 (9) , 4871-4880 | Langmuir
Research insight into the change of aggregation structure of BOPP films and its influence on electrical properties under accelerated thermal aging SCIE
期刊论文 | 2024 , 141 (43) | JOURNAL OF APPLIED POLYMER SCIENCE
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Abstract :

Biaxially oriented polypropylene (BOPP) film used in pulse film capacitors withstands high temperatures for a long time. This leads to frequent faults in pulse film capacitors, affecting the reliability of the pulse system. In this paper, the thermal aging tests of BOPP films at 100 degrees C for 10-80 days are carried out in this paper, and the physicochemical and electrical properties of the aging materials are characterized. The results show that more deep and shallow traps to BOPP films are introduced during the thermal aging process. With the increase in aging time, the breakdown field strength gradually decreases, and the conductivity decreases first and then increases. Under the action of thermal aging for a long time, the recrystallization of materials and the destruction of molecular chains by thermal aging are the main reasons for the increase of traps and the decrease of breakdown field strength. The former is dominant in the early stage of aging, and the latter is dominant in the late stage of aging. Therefore, the conductivity shows the law of slow decrease first and then rapid increase. The relevant research provides a theoretical foundation for the process improvement and life prediction of BOPP films.

Keyword :

BOPP film BOPP film electrical properties electrical properties microscopy microscopy structure-property relationship structure-property relationship thermal aging thermal aging

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GB/T 7714 Zhang, Yunxiao , Zhang, Jiarui , Liu, Yuhao et al. Research insight into the change of aggregation structure of BOPP films and its influence on electrical properties under accelerated thermal aging [J]. | JOURNAL OF APPLIED POLYMER SCIENCE , 2024 , 141 (43) .
MLA Zhang, Yunxiao et al. "Research insight into the change of aggregation structure of BOPP films and its influence on electrical properties under accelerated thermal aging" . | JOURNAL OF APPLIED POLYMER SCIENCE 141 . 43 (2024) .
APA Zhang, Yunxiao , Zhang, Jiarui , Liu, Yuhao , Lin, Wenxin , Chi, Zhengnan , Zhang, Tianfeng et al. Research insight into the change of aggregation structure of BOPP films and its influence on electrical properties under accelerated thermal aging . | JOURNAL OF APPLIED POLYMER SCIENCE , 2024 , 141 (43) .
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Research insight into the change of aggregation structure of BOPP films and its influence on electrical properties under accelerated thermal aging EI
期刊论文 | 2024 , 141 (43) | Journal of Applied Polymer Science
Research insight into the change of aggregation structure of BOPP films and its influence on electrical properties under accelerated thermal aging Scopus
期刊论文 | 2024 , 141 (43) | Journal of Applied Polymer Science
Hygrothermal aging mechanism of epoxy composites used for medium-frequency transformers SCIE
期刊论文 | 2024 , 228 | POLYMER DEGRADATION AND STABILITY
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Abstract :

The integration of medium-frequency transformer design and the harsh service environment raise higher demands for the medium-frequency insulation performance of epoxy composites. As epoxy composite's frequency response characteristics and sensitivity to moisture intrusion are still unknown, its application as the insulation materials of medium-frequency transformers under hygrothermal conditions is limited. This paper investigates the mechanism of moisture intrusion damage to the molecular structure of the epoxy resin matrix and its crosslinking points with the curing agent. The regularity of medium-frequency insulation performance degradation of epoxy composites after hygrothermal aging is studied. Results indicate that after 40 days of hygrothermal aging, moisture together with high temperature damaged the main chain of the epoxy resin and its cross-linking points with the curing agent, resulting in a 23 degrees C decrease in the glass transition temperature and an 82 % decrease in cross-linking density of the epoxy composite. Moisture ionization and the increase of carriers due to epoxy resin hydrolysis lead to an increase in the amount of space charge. The temperature rise caused by dipole steering polarization facilitates the formation of internal conductive pathways in the epoxy composite, resulting in a 73 % decrease in the medium-frequency breakdown strength and a four-order magnitude decrease in the mediumfrequency volume resistivity of the epoxy composite. This study can guide the insulation design of highreliability medium-frequency transformers.

Keyword :

Charge distribution performance Charge distribution performance Epoxy resin Epoxy resin Hygrothermal aging Hygrothermal aging Medium-frequency breakdown performance Medium-frequency breakdown performance Medium-frequency transformer Medium-frequency transformer

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GB/T 7714 Luo, Zimin , Wang, Liming , Zhao, Biao et al. Hygrothermal aging mechanism of epoxy composites used for medium-frequency transformers [J]. | POLYMER DEGRADATION AND STABILITY , 2024 , 228 .
MLA Luo, Zimin et al. "Hygrothermal aging mechanism of epoxy composites used for medium-frequency transformers" . | POLYMER DEGRADATION AND STABILITY 228 (2024) .
APA Luo, Zimin , Wang, Liming , Zhao, Biao , Yin, Fanghui , Li, Jianchao , Cui, Bin et al. Hygrothermal aging mechanism of epoxy composites used for medium-frequency transformers . | POLYMER DEGRADATION AND STABILITY , 2024 , 228 .
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Hygrothermal aging mechanism of epoxy composites used for medium-frequency transformers Scopus
期刊论文 | 2024 , 228 | Polymer Degradation and Stability
Hygrothermal aging mechanism of epoxy composites used for medium-frequency transformers EI
期刊论文 | 2024 , 228 | Polymer Degradation and Stability
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