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学者姓名：兑卫真
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Abstract ：
对热循环条件下Sn3.0Ag0.5Cu/Cu焊接接头界面金属间化合物(IMC)进行观察及力学性能实验,研究界面金属间化合物生长及接头抗拉强度的演变规律。改变保温时间、最低极限温度等热循环参量来做对比试验,同时在热循环上限温度下做等温时效试验与热循环试验对比。结果表明:随着循环周次的增加,界面金属间化合物的等效厚度不断增加,且下限温度越低界面金属间化合物生长越快,接头抗拉强度先稍有增加后不断下降;当在上限温度保温相同时间时,等温时效条件下界面金属间化合物的生长速率比热循环条件下快,未经历低温过程,界面原子扩散一直保持相对较快的速度。
Keyword ：
力学性能 力学性能 无铅焊料 无铅焊料 显微组织 显微组织 热循环 热循环 等温时效 等温时效
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| GB/T 7714 | 杨晓华 , 杨思佳 , 兑卫真 et al. SnAgCu/Cu钎焊接头热循环时效组织与性能 [J]. | 材料热处理学报 , 2018 , 39 (04) : 145-150 . |
| MLA | 杨晓华 et al. "SnAgCu/Cu钎焊接头热循环时效组织与性能" . | 材料热处理学报 39 . 04 (2018) : 145-150 . |
| APA | 杨晓华 , 杨思佳 , 兑卫真 , 李晓延 . SnAgCu/Cu钎焊接头热循环时效组织与性能 . | 材料热处理学报 , 2018 , 39 (04) , 145-150 . |
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Abstract ：
对热循环条件下Sn3.0Ag0.5Cu/Cu焊接接头界面金属间化合物(IMC)进行观察及力学性能实验,研究界面金属间化合物生长及接头抗拉强度的演变规律.改变保温时间、最低极限温度等热循环参量来做对比试验,同时在热循环上限温度下做等温时效试验与热循环试验对比.结果表明:随着循环周次的增加,界面金属间化合物的等效厚度不断增加,且下限温度越低界面金属间化合物生长越快,接头抗拉强度先稍有增加后不断下降;当在上限温度保温相同时间时,等温时效条件下界面金属间化合物的生长速率比热循环条件下快,未经历低温过程,界面原子扩散一直保持相对较快的速度.
Keyword ：
力学性能 力学性能 无铅焊料 无铅焊料 显微组织 显微组织 热循环 热循环 等温时效 等温时效
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| GB/T 7714 | 杨晓华 , 杨思佳 , 兑卫真 et al. SnAgCu/Cu钎焊接头热循环时效组织与性能 [J]. | 材料热处理学报 , 2018 , 39 (4) : 145-150 . |
| MLA | 杨晓华 et al. "SnAgCu/Cu钎焊接头热循环时效组织与性能" . | 材料热处理学报 39 . 4 (2018) : 145-150 . |
| APA | 杨晓华 , 杨思佳 , 兑卫真 , 李晓延 . SnAgCu/Cu钎焊接头热循环时效组织与性能 . | 材料热处理学报 , 2018 , 39 (4) , 145-150 . |
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Abstract ：
采用光学显微镜和场发射扫描电镜观察了TC4钛合金激光焊接接头的显微组织,测量了接头焊缝中心到母材的显微硬度.结果表明,母材由α相和其相界上断续分布的粒状β相组成.焊接接头组织由粗大等轴晶区、柱状晶区、细等轴晶区和热影响区过热组织组成.粗大等轴晶区组织形态有层片状α+β、魏氏体α和网篮状α+β3种,其显微硬度略低于柱状晶区和细等轴晶区,但比母材高;柱状晶区和细等轴晶区组织为针状马氏体,柱状晶区显微硬度相对较高.热影响区显微硬度与母材相差不大.
Keyword ：
TC4合金 TC4合金 微观组织 微观组织 激光焊接 激光焊接
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| GB/T 7714 | 杨晓华 , 杨武林 , 兑卫真 et al. TC4钛合金激光焊接头微观组织和硬度 [J]. | 材料热处理学报 , 2014 , 35 (10) : 70-74 . |
| MLA | 杨晓华 et al. "TC4钛合金激光焊接头微观组织和硬度" . | 材料热处理学报 35 . 10 (2014) : 70-74 . |
| APA | 杨晓华 , 杨武林 , 兑卫真 , 李晓延 . TC4钛合金激光焊接头微观组织和硬度 . | 材料热处理学报 , 2014 , 35 (10) , 70-74 . |
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Abstract ：
研究了TC4钛合金薄板激光焊接接头及母材的疲劳性能,并对其疲劳断口进行了观察.结果表明,接头的疲劳寿命在低应力水平时高于母材,在高应力水平时低于母材.母材疲劳裂纹萌生于试样表面;在裂纹扩展区有平行排列的弯曲的二次裂纹和期间更细的疲劳辉纹,瞬断区为细小的等轴韧窝.焊缝疲劳裂纹起源于表面的气孔,源区有笔直且平行排列的二次裂纹;在裂纹扩展区,断口形貌与组织有关,细晶区为韧窝,在细晶与柱状晶交界处为敞口浅韧窝,柱状晶和粗晶区为晶粒大小的刻面,上有大量的微剪切滑移带,断裂机理为滑移带形成及开裂.
Keyword ：
激光焊接 激光焊接 疲劳性能 疲劳性能 钛合金 钛合金
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| GB/T 7714 | 杨武林 , 杨晓华 , 李晓延 et al. TC4钛合金薄板激光焊接接头的疲劳寿命及断口分析 [J]. | 焊接学报 , 2012 , 33 (3) : 105-108 . |
| MLA | 杨武林 et al. "TC4钛合金薄板激光焊接接头的疲劳寿命及断口分析" . | 焊接学报 33 . 3 (2012) : 105-108 . |
| APA | 杨武林 , 杨晓华 , 李晓延 , 兑卫真 , 林建航 , 李晋伟 et al. TC4钛合金薄板激光焊接接头的疲劳寿命及断口分析 . | 焊接学报 , 2012 , 33 (3) , 105-108 . |
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Abstract ：
采用Ni基非晶态合金作为中间层对TC4钛合金进行了不同工艺参数的真空搭接扩散焊试验,通过对接头性能测试及对接头微观组织分析,研究了扩散焊工艺参数对接头性能的影响规律.试验结果表明,焊接温度和保温时间对接头质量有很大的影响.在本试验条件下,TG4钛合金添加Ni基合金为中间层扩散焊的最佳焊接工艺为焊接温度1 020℃、焊接压力0MPa、保温时间100 min.然而,添加Ni基合金的扩散焊接试样的拉伸性能比直接扩散焊试样低.
Keyword ：
TC4钛合金 TC4钛合金 微观组织 微观组织 扩散焊接 扩散焊接 拉伸性能 拉伸性能
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| GB/T 7714 | 吕涛 , 杨武林 , 林鹏 et al. 采用Ni基合金为中间层的TC4钛合金扩散焊接工艺 [J]. | 焊接技术 , 2011 , 40 (9) : 27-31 . |
| MLA | 吕涛 et al. "采用Ni基合金为中间层的TC4钛合金扩散焊接工艺" . | 焊接技术 40 . 9 (2011) : 27-31 . |
| APA | 吕涛 , 杨武林 , 林鹏 , 兑卫真 , 蒋力培 , 杨晓华 . 采用Ni基合金为中间层的TC4钛合金扩散焊接工艺 . | 焊接技术 , 2011 , 40 (9) , 27-31 . |
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研究Sn-3.8Ag-0.7Cu/Cu焊料接头界面的微观组织在150℃时效不同时间后的演变过程,对时效不同时间的试样进行抗拉强度测定,并在扫描电镜下进行动态拉伸原位观察和拉伸断口的形貌观察.结果表明,Sn-3.8Ag-0.7Cu/Cu焊料接头试样在焊后的界面上形成扇贝状的Cu6Sn5金属间化合物(intermetallic compound,IMC)层,随着时效时间的增加,界面IMC的厚度增加,Cu6Sn5扇柱变长变粗,最后离开界面层进入焊料, 时效480 h后在焊料和Cu6Sn5界面析出Ag3Sn相.拉伸实验结果表明,焊料接头的强度在时效初期略有增加,时效48 h后强度逐渐下降;动态拉伸结果表明,时效初期断裂发生在焊料基体内部,随着时效时间的增加,断裂发生的位置逐渐向界面转移,在时效480 h后断裂完全发生在界面化合物层.
Keyword ：
拉伸 拉伸 断裂 断裂 无铅焊料 无铅焊料 时效 时效 金属间化合物(intermetallic compound,IMC) 金属间化合物(intermetallic compound,IMC)
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| GB/T 7714 | 李晓延 , 杨晓华 , 兑卫真 et al. 时效对Sn-3.8Ag-0.7Cu/Cu焊料接头的组织和拉伸性能的影响 [J]. | 机械强度 , 2008 , 30 (1) : 24-28 . |
| MLA | 李晓延 et al. "时效对Sn-3.8Ag-0.7Cu/Cu焊料接头的组织和拉伸性能的影响" . | 机械强度 30 . 1 (2008) : 24-28 . |
| APA | 李晓延 , 杨晓华 , 兑卫真 , 吴本生 , 严永长 . 时效对Sn-3.8Ag-0.7Cu/Cu焊料接头的组织和拉伸性能的影响 . | 机械强度 , 2008 , 30 (1) , 24-28 . |
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Abstract ：
使用场发射透射电镜及其扫描透射装置(STEM)和高角环形暗场像(HAADF)装置及EDS能谱仪研究了溶胶凝胶法制备的TiO2纳米微粒在电子束照射下晶体结构发生变化的现象,在200kV电子束照射下,经过不同时间的原位观察发现,纳米TiO2颗粒由开始的体心正方141/amd(141)锐钛矿TiO2晶型转变为非晶体,随后又在电子束的照射下晶化为简单正方P42/mnm(136)金红石TiO2单晶,随后转变为尺寸更小的金红石TiO2纳米多晶体.HADDF图可以看到最后的晶粒细化过程中,原子有选择的进行迁移,使晶化区域的样品厚度不均匀化,能谱分析证明样品中只有TiO2存在.
Keyword ：
二氧化钛 二氧化钛 原位观察 原位观察 电子束辐照 电子束辐照
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| GB/T 7714 | 杨晓华 , 兑卫真 , 刘艳斌 . 电子束照射下纳米TiO2晶型转变的高分辨透射电镜原位观察 [J]. | 材料热处理学报 , 2008 , 29 (3) : 14-16 . |
| MLA | 杨晓华 et al. "电子束照射下纳米TiO2晶型转变的高分辨透射电镜原位观察" . | 材料热处理学报 29 . 3 (2008) : 14-16 . |
| APA | 杨晓华 , 兑卫真 , 刘艳斌 . 电子束照射下纳米TiO2晶型转变的高分辨透射电镜原位观察 . | 材料热处理学报 , 2008 , 29 (3) , 14-16 . |
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Abstract ：
The scallop-like Cu(6)Sn(5) intermetellic compound (IMC) layer formed at the interface of Sn-3.8Ag-0.7Cu/Cu joint as soldered. These IMC layers graw during aging at 150 degrees C. The fracture damage micro-mechanism of the joints is different when they have a different IMC thickness. When the thickness of IMC layer is less than 5.5 mu m, ductile fracture occurred in the solder. When it is more than 9 mu m, brittle fracture occurred between the solder and Cu. Scan Electronic Microscopy micro-analyses show that the fracture at the boundary could occur in one of following positions. One is the interface of Cu(6)Sn(5) intermetallic compound and solder. Another is the cleavage intermetallic compound grains. The more thick the I MC layer, the more brittle the IMC, the lower the strength of the interface. The fracture position moved from solder inner to the interfacial CU(6)Sn(5) IMC layer with the IMC thickness increased. in addition, when aging for 480h, the Ag(3)Sn compound formed between solder and Cu(6)Sn(5) compound. The strength of solder is also decreased during aging. The weakening of the solder matrix is caused by the coarsening of the eutectic solder structures, The weakening of the interfacial I MC layer is caused by the size increase of the I MC grains and the decrease of connecting area of IMC layer and the solder.
Keyword ：
Fracture damage Fracture damage Intermetalic Compound Intermetalic Compound Solder joint Solder joint
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| GB/T 7714 | Yang, Xiaohua , Li, Xiaoyan , Dui, Weizhen . Fracture damage micro-mechanism of SnAgCu/Cu solder joint [C] . 2008 : 401-405 . |
| MLA | Yang, Xiaohua et al. "Fracture damage micro-mechanism of SnAgCu/Cu solder joint" . (2008) : 401-405 . |
| APA | Yang, Xiaohua , Li, Xiaoyan , Dui, Weizhen . Fracture damage micro-mechanism of SnAgCu/Cu solder joint . (2008) : 401-405 . |
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In situ observation of crystal structure variations induced by electron-beam irradiation in nanometer-sized titania prepared by sol-gel method was performed using high-resolution electron microscopy. The results show that amorphous region formed at the edge of anatase titania grain during the initial irradiation, and then the grain changes to entire amorphous structure. With the irradiation time increase, crystallization occurs in the amorphous titania grain and rutile titania crystal forms, and one rutile titania grain changes to several rutile titania grains. More fine rutile titania crystal grains form at the end of irradiation. The HAADF image shows that these thinned grains have asymmetrical thickness after irradiation more than 20 min. The composition of the specimen is analyzed by EDS.
Keyword ：
Crystal structure Crystal structure Electron beams Electron beams Electrons Electrons High resolution electron microscopy High resolution electron microscopy Irradiation Irradiation Oxide minerals Oxide minerals Radiation Radiation Sol-gel process Sol-gel process Sol-gels Sol-gels Titanium dioxide Titanium dioxide
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| GB/T 7714 | Yang, Xiao-Hua , Dui, Wei-Zhen , Liu, Yan-Bin . HRTEM in situ observation of nanometer-sized titania crystal structures variation by electron-beam irradiation [J]. | Transactions of Materials and Heat Treatment , 2008 , 29 (3) : 14-16 . |
| MLA | Yang, Xiao-Hua et al. "HRTEM in situ observation of nanometer-sized titania crystal structures variation by electron-beam irradiation" . | Transactions of Materials and Heat Treatment 29 . 3 (2008) : 14-16 . |
| APA | Yang, Xiao-Hua , Dui, Wei-Zhen , Liu, Yan-Bin . HRTEM in situ observation of nanometer-sized titania crystal structures variation by electron-beam irradiation . | Transactions of Materials and Heat Treatment , 2008 , 29 (3) , 14-16 . |
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The microstructure evolution of the interface of Sn-3.8Ag-0.7Cu/Cu solder joint after aging for different time at 150°C was investigated. The tensile strength test was carried out on the samples after aging for different time and dynamic tensile in situ observation and tensile fracture surface of the samples were studied by SEM (scanning electron microscopy). The results show that scallop-like Cu6Sn5 IMC (intermetallic compound) layer formed at the interface of Sn-3.8Ag-0.7Cu/Cu joint as soldered. With the increase of aging time, the depth of interfacial IMC increased and Cu6Sn5 column became lengthened and coarsened and finally left interfacial IMC layer into solder. The Ag3Sn phase formed at the interface of solder and Cu6Sn5 after aging for 480 h. The results of tensile experiment show that the tensile strength of the joint slightly increases at the initial stages of aging and decreases gradually after aging for 48 h. The results of dynamic tensile show that fracture took place inside the solder matrix at the initial stages of aging. With the increase of aging time, the position of fracture gradually moves to interface and after aging for 480 h, the fracture completely took place at the interfacial IMC layer.
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| GB/T 7714 | Li, Xiaoyan , Yang, Xiaohua , Dui, Weizhen et al. Effect of aging on microstructure and tensile properties of Sn-3.8Ag-0.7Cu/Cu solder joint [J]. | Journal of Mechanical Strength , 2008 , 30 (1) : 24-28 . |
| MLA | Li, Xiaoyan et al. "Effect of aging on microstructure and tensile properties of Sn-3.8Ag-0.7Cu/Cu solder joint" . | Journal of Mechanical Strength 30 . 1 (2008) : 24-28 . |
| APA | Li, Xiaoyan , Yang, Xiaohua , Dui, Weizhen , Wu, Benshen , Yan, Yongchang . Effect of aging on microstructure and tensile properties of Sn-3.8Ag-0.7Cu/Cu solder joint . | Journal of Mechanical Strength , 2008 , 30 (1) , 24-28 . |
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