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学者姓名：李亚强
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铜柱互连因具有细间距、高导电性、高可靠性的优点,成为传统焊点的替代品.然而,铜柱生长过程容易形成光滑度很差的凹凸表面,严重影响铜柱的可靠性.本文采用有限元方法研究了加速剂聚二硫二丙烷磺酸钠(SPS)对铜柱生长的影响.基于电化学测试、分子动力学模拟以及有限元拟合方法,建立了基于物质传质、添加剂吸附、电极表面电化学还原以及铜柱生长的有限元仿真模型.在无添加剂的条件下,铜柱的生长可分为均匀生长阶段和凹形生长阶段,最终会形成凹形的铜柱顶面.引入SPS后,在生长过程中,SPS会在底角处积累,铜柱的生长呈现"V"形生长的特点.随着"V"形生长的进行,由于铜柱的轮廓拓扑变化,会在中间部位形成新的底角,SPS在中间区域的积累会加速铜的沉积.因而通过调控SPS的浓度,可以调控铜柱的生长过程,得到高均匀性的铜柱.
Keyword ：
分子动力学模拟 分子动力学模拟 均匀性 均匀性 有限元模拟 有限元模拟 铜柱生长 铜柱生长
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| GB/T 7714 | 彭雪嵩 , 江杰 , 李铭杰 et al. 基于有限元方法分析加速剂SPS对铜柱凸点互连均匀性的影响 [J]. | 电镀与精饰 , 2025 , 47 (3) : 10-17 . |
| MLA | 彭雪嵩 et al. "基于有限元方法分析加速剂SPS对铜柱凸点互连均匀性的影响" . | 电镀与精饰 47 . 3 (2025) : 10-17 . |
| APA | 彭雪嵩 , 江杰 , 李铭杰 , 王福学 , 罗秀彬 , 杨培霞 et al. 基于有限元方法分析加速剂SPS对铜柱凸点互连均匀性的影响 . | 电镀与精饰 , 2025 , 47 (3) , 10-17 . |
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High-entropy alloys (HEAs) show great potential for catalyzing complex multi-step reactions, but optimizing their parameters, i.e., composition, but also their crystallinity and morphology, remains a significant challenge. In this study, FeCoNiMoW HEAs are synthesized into either amorphous nanosheets (HEANS) or crystalline nanoparticles (HEANP), which are then used to catalyze the lithium-sulfur (Li-S) reaction of Li-S batteries (LSBs). Evaluations in symmetric cells, coin cells, and pouch cells reveal that HEANS significantly enhance LSB performance, achieving initial discharge capacities up to 1632 mAh g-1. The batteries also exhibit excellent cycling stability over 1000 cycles at 3Cand maintain high-rate performance up to 10C with a capacity of 614 mAh g-1. Comprehensive in situ analyses and density functional theory calculations demonstrate that amorphous HEANS provide more active sites, better ionic conductivity and stronger chemical interactions with lithium polysulfides (LiPS). These properties effectively suppress the shuttle effect, promote the complete S8 -> Li2S conversion by reducing the impedance of the solid-electrolyte interphase, and accelerate the Li2S4 -> Li2S2 step by lowering the nucleation energy barrier. Overall, this study highlights the superior catalytic properties of amorphous 2D HEAs in LSBs and offers new insights into the mechanisms of LiPS conversion.
Keyword ：
amorphous amorphous high entropy alloy high entropy alloy in situ electrochemical impedance spectroscopy in situ electrochemical impedance spectroscopy in situ Raman in situ Raman Li-S batteries Li-S batteries
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| GB/T 7714 | He, Ren , Lee, Seungho , Ding, Yang et al. Amorphous High Entropy Alloy Nanosheets Enabling Robust Li-S Batteries [J]. | ADVANCED FUNCTIONAL MATERIALS , 2025 . |
| MLA | He, Ren et al. "Amorphous High Entropy Alloy Nanosheets Enabling Robust Li-S Batteries" . | ADVANCED FUNCTIONAL MATERIALS (2025) . |
| APA | He, Ren , Lee, Seungho , Ding, Yang , Huang, Chen , Lu, Xuan , Zheng, Lirong et al. Amorphous High Entropy Alloy Nanosheets Enabling Robust Li-S Batteries . | ADVANCED FUNCTIONAL MATERIALS , 2025 . |
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The work aims to systematically improve the roughening performance of electrolytic copper foil with a composite additive of sodium molybdate, sodium tungstate, and hydroxyethyl cellulose (HEC). Electrolytic copper foil is widely used in electronic devices, especially printed circuit boards (PCBs), with key performance requirements including high peel strength and low surface roughness. In order to optimize these properties, direct current electroplating was used in a copper sulfate electroplating system and various characterization techniques were employed such as scanning electron microscopy (SEM), laser confocal microscopy (LCM), and peel strength testing. The microstructure of the rough copper foil was analyzed in detail, and the impact of various additives on the roughening effect was analyzed through orthogonal experiments and range analysis. The addition of sodium molybdate and HEC alone significantly refined the grain structure of the copper foil surface, improving its smoothness and uniformity. In contrast, sodium tungstate mainly improved the peel strength and had a relatively small impact on grain refinement. The composite additive showed significant synergistic effects, effectively optimizing the microstructure of copper foil under different concentration combinations. Specifically, the concentrations of 40 mg/L sodium molybdate, 30 mg/L sodium tungstate, and 8 mg/L HEC produced the best roughening results, with the lowest surface roughness (Rz=1.24 µm) and relatively high peel strength (0.94 N/mm). LCM measurements indicated that optimized composite additives significantly reduced surface roughness, helping to minimize signal transmission losses and improve the overall performance and reliability of PCBs. In addition, the importance of the three additives on Q was in the following order: sodium molybdate>sodium tungstate>HEC, and the Q value reached its maximum value (0.76) under optimal conditions. Through a comprehensive analysis of the additive mechanism, the optimal composite additive formulation was identified, significantly improving the roughening performance of copper foil. This method not only enhanced peel strength and surface roughness but also promoted grain refinement, making the copper foil perform exceptionally in high-performance electronic applications. The synergistic effect of the composite additive optimized the microstructure of the copper foil, further improving its overall mechanical properties and adhesion characteristics. The study results demonstrated that the composite additive achieved good effects under different concentration conditions, providing technical support for producing low-profile copper foil suitable for high-performance electronic devices. By systematically optimizing the concentrations of sodium molybdate, sodium tungstate, and HEC composite additives, this study significantly improves the surface and mechanical properties of ultra-thin electrolytic copper foil, proposing innovative research findings. This research provides new directions for the preparation of low-profile electrolytic copper foil, with significant theoretical and practical value. By reducing surface roughness while maintaining high peel strength, this study lays a solid technical foundation for the miniaturization, high performance, and long-term reliability of future electronic devices, further advancing copper foil technology in the electronics industry. © 2025 Chongqing Wujiu Periodicals Press. All rights reserved.
Keyword ：
Copper refining Copper refining Surface roughness Surface roughness
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| GB/T 7714 | Peng, Xuesong , Gui, Haoliang , Jiang, Jie et al. Effect of Sodium Tungstate and Its Composite Additives on the Roughening Effect of Ultra-thin Copper Foil [J]. | Surface Technology , 2025 , 54 (8) : 191-200 . |
| MLA | Peng, Xuesong et al. "Effect of Sodium Tungstate and Its Composite Additives on the Roughening Effect of Ultra-thin Copper Foil" . | Surface Technology 54 . 8 (2025) : 191-200 . |
| APA | Peng, Xuesong , Gui, Haoliang , Jiang, Jie , Li, Yaqiang , Wang, Zongtai , Li, Ruopeng et al. Effect of Sodium Tungstate and Its Composite Additives on the Roughening Effect of Ultra-thin Copper Foil . | Surface Technology , 2025 , 54 (8) , 191-200 . |
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As one of the most promising non-noble metal catalysts for the oxygen reduction reaction (ORR), the atomically dispersed iron, nitrogen co-coordinated carbon (Fe-N-C) catalyst featuring Fe-Nx sites has gained widespread application in fuel cells and Zn-air batteries due to its highest atomic utilization, tunable electronic structure and excellent catalytic activity. In this review, we provide a comprehensive summary and discussion of recent advancements in atomically dispersed Fe-N-C catalysts. Initially, the design principles and preparation methods for efficient Fe-N-C are introduced in detail, focusing on three key aspects: enhancing active site loading, improving intrinsic activity and constructing hierarchical porous structures. Additionally, this review systematically summarizes the application of various advanced characterization techniques in the structural analysis of active sites. Finally, we outline the existing challenges and research directions of atomically dispersed Fe-N-C, offering new insights and guidance for the future development of high-performance oxygen reduction catalysts.
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| GB/T 7714 | Xu, Hao , Li, Ruopeng , Li, Yaqiang et al. Research progress of atomically dispersed iron, nitrogen co-coordinated carbon catalysts for oxygen reduction: a mini-review [J]. | JOURNAL OF MATERIALS CHEMISTRY A , 2025 , 13 (19) : 13675-13692 . |
| MLA | Xu, Hao et al. "Research progress of atomically dispersed iron, nitrogen co-coordinated carbon catalysts for oxygen reduction: a mini-review" . | JOURNAL OF MATERIALS CHEMISTRY A 13 . 19 (2025) : 13675-13692 . |
| APA | Xu, Hao , Li, Ruopeng , Li, Yaqiang , Lu, Xiangyu , Liu, Huan , Yang, Peixia et al. Research progress of atomically dispersed iron, nitrogen co-coordinated carbon catalysts for oxygen reduction: a mini-review . | JOURNAL OF MATERIALS CHEMISTRY A , 2025 , 13 (19) , 13675-13692 . |
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The roughening layer on the electrolytic copper foil is crucial to the performance of printed circuit boards (PCBs). Additives provide a straightforward and efficient method for improving the performance of the copper foil roughening layer. This study introduces N,N-dimethyl-dithiocarbamate propanesulfonate (DPS) for the first time as an electrochemical roughening additive for copper foils. The effect of DPS concentration on roughening morphology and copper deposition was investigated using techniques such as scanning electron microscopy (SEM), atomic force microscopy (AFM), cyclic voltammetry (CV), linear sweep voltammetry (LSV), electrochemical impedance spectroscopy (EIS), and chronoamperometry (CA). In addition, density functional theory (DFT) calculations, in situ Raman spectroscopy, and electrochemical quartz crystal microbalance (EQCM) were employed to examine the adsorption interactions between DPS, the copper substrate, and copper ions. At a concentration of 20 mg/L, the copper foil roughening layer exhibited significant improvement in morphology, resulting in the successful preparation of a high-volume low-profile (HVLP) copper foil. The roughening layer achieved an R Z value as low as 1.09 mu m and a peel strength of 1.02 N/mm.
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| GB/T 7714 | Peng, Xuesong , Zhou, Xu , Jiang, Jie et al. Theoretical Research and Application of Additive DPS in the Electrochemical Microroughening Layer of Copper Foil [J]. | LANGMUIR , 2025 , 41 (9) : 6081-6091 . |
| MLA | Peng, Xuesong et al. "Theoretical Research and Application of Additive DPS in the Electrochemical Microroughening Layer of Copper Foil" . | LANGMUIR 41 . 9 (2025) : 6081-6091 . |
| APA | Peng, Xuesong , Zhou, Xu , Jiang, Jie , Li, Yaqiang , Wang, Guangzhao , Li, Ruopeng et al. Theoretical Research and Application of Additive DPS in the Electrochemical Microroughening Layer of Copper Foil . | LANGMUIR , 2025 , 41 (9) , 6081-6091 . |
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The void-free blind microvia copper electroplating process is a key technology in HDI PCB manufacturing. This work systematically studied the influence of the Acid Blue 1 (AB1) leveler on blind microvia filling. AB1 exhibits excellent suppression during electroplating, with its effect strengthening as the AB1 concentration increases. Chronopotentiometry was used to study the interaction among AB1, SPS, and PEG. There is a synergistic suppressing interaction between the new leveler AB1 and suppressor PEG, while there is competition between AB1 and accelerator SPS. During electrodeposition, AB1 can adsorb on the copper substrate to reduce active sites and suppress copper electrodeposition, based on theoretical studies and in situ infrared spectroscopy. At the optimized electroplating process, void-free microvia filling is achieved with 20 mg L-1 AB1 and successive electroplating confirms the stability of AB1. Based on diffusion differences among additives and the competition between AB1 and SPS, a gradient competitive adsorption superfilling mechanism was proposed to illustrate the filling process of the AB1-SPS-PEG system. AB1 is beneficial to improving flatness and lowering surface roughness of the copper layer, which is conducive to reducing signal losses during high-frequency transmission. Additionally, AB1 can modulate the preferential formation of Cu(111) and Cu(200) and facilitate grain refinement.
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| GB/T 7714 | Li, Mingjie , Peng, Xuesong , Jiang, Jie et al. Filling performance of an Acid Blue 1 leveler on blind microvias [J]. | NEW JOURNAL OF CHEMISTRY , 2025 , 49 (11) : 4538-4546 . |
| MLA | Li, Mingjie et al. "Filling performance of an Acid Blue 1 leveler on blind microvias" . | NEW JOURNAL OF CHEMISTRY 49 . 11 (2025) : 4538-4546 . |
| APA | Li, Mingjie , Peng, Xuesong , Jiang, Jie , Li, Yaqiang , Meng, Fan , Wu, Youzheng et al. Filling performance of an Acid Blue 1 leveler on blind microvias . | NEW JOURNAL OF CHEMISTRY , 2025 , 49 (11) , 4538-4546 . |
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P doping in Fe-Cu@NC materials is an effective strategy aiming at improving the catalytic activity of oxygen reduction reaction (ORR). However, there is currently a lack of theoretical research about the influence of phosphorus atoms in different coordination layers on performance. Therefore, the formation energy and binding energy of Fe-Cu@NC doped with P atom are calculated by first principles calculation method. The effects of different doping sites on the stability of the catalysts were further studied. The configurations and corresponding ORR activities of eleven kinds of Fe-Cu-Pn@NC (n = 0 similar to 10) catalysts were elaborated in details. The results show that Fe-Cu-P2@NC exhibits the highest ORR activity with a limit potential of 0.81 V under vacuum condition. This study can provide theoretical guidance for rational design of high-performance catalysts.
Keyword ：
DFT DFT Double atom catalysts Double atom catalysts ORR mechanisms ORR mechanisms P doping P doping
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| GB/T 7714 | Wu, Youzheng , Ren, Penghui , Li, Ruopeng et al. Investigation of the structure-activity relationship of phosphorus-doped Fe-Cu@NC catalysts: Exploring the influence of different coordination layers on oxygen reduction reaction activity [J]. | JOURNAL OF POWER SOURCES , 2025 , 631 . |
| MLA | Wu, Youzheng et al. "Investigation of the structure-activity relationship of phosphorus-doped Fe-Cu@NC catalysts: Exploring the influence of different coordination layers on oxygen reduction reaction activity" . | JOURNAL OF POWER SOURCES 631 (2025) . |
| APA | Wu, Youzheng , Ren, Penghui , Li, Ruopeng , Zheng, Xun , Bai, Chengye , Liu, Yidi et al. Investigation of the structure-activity relationship of phosphorus-doped Fe-Cu@NC catalysts: Exploring the influence of different coordination layers on oxygen reduction reaction activity . | JOURNAL OF POWER SOURCES , 2025 , 631 . |
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Theoretically, triggering the lattice oxygen mechanism (LOM) of the catalysts during the alkaline oxygen evolution reaction (OER) can effectively break through the thermodynamic limitations, while following this path, the rate of simultaneous deprotonation also determines the overall kinetics. A cerium oxide units-modified cobalt (oxy)hydroxide nanocomposite of CeO2-CoOOH/NF is proposed, where the Ce(4f)-O(2p)-Co (3d) coupling with sites interaction mediates the Co & horbar;O Mott-Hubbard splitting state to trigger efficient LOM. Meanwhile, the 4f orbital electron-rich state near the Fermi level is favorable for proceeding the electron-involved deprotonation behavior. All these empower CeO2-CoOOH/NF with considerable OER activity, which delivers an overpotential of 249 mV at 10 mA cm-2, and coupling with commercial Pt/C in anion exchange membrane water electrolyze (AEMWE) to realize energy-saving hydrogen production. This work is instructive for the design of high-performance OER catalysts through controlling the electron orbitals hybridization state of the catalysts to synchronously accelerate the kinetics of each link in OER.
Keyword ：
cerium oxide units modification cerium oxide units modification cobalt (oxy)hydroxide cobalt (oxy)hydroxide comprehensive kinetics improvement comprehensive kinetics improvement electronic structure optimization electronic structure optimization oxygen evolution reaction oxygen evolution reaction
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| GB/T 7714 | Li, Ruopeng , Wu, Youzheng , Yang, Peixia et al. Cerium Oxide-Induced Synchronous Lattice Oxygen Activation and Accelerated Deprotonation Kinetics in Cobalt (oxy)Hydroxide for Robust Water Oxidation [J]. | SMALL , 2025 , 21 (10) . |
| MLA | Li, Ruopeng et al. "Cerium Oxide-Induced Synchronous Lattice Oxygen Activation and Accelerated Deprotonation Kinetics in Cobalt (oxy)Hydroxide for Robust Water Oxidation" . | SMALL 21 . 10 (2025) . |
| APA | Li, Ruopeng , Wu, Youzheng , Yang, Peixia , Wang, Dan , Xu, Hao , Li, Yaqiang et al. Cerium Oxide-Induced Synchronous Lattice Oxygen Activation and Accelerated Deprotonation Kinetics in Cobalt (oxy)Hydroxide for Robust Water Oxidation . | SMALL , 2025 , 21 (10) . |
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In this study, we encapsulated Bi in hollow carbon spheres to form a nanoreactor. It shows good activation ability for CO2 and NO3-, and significantly enhances the coupling of C-N intermediates. This improves urea selectivity by 66% compared to unencapsulated Bi-based catalysts and shows good stability.
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| GB/T 7714 | Wu, Yue , Zhang, Bozhao , Yu, Yuan et al. Boosting small-molecule reduction with bismuth-based nanostructured reactors [J]. | CHEMICAL COMMUNICATIONS , 2025 , 61 (58) : 10800-10803 . |
| MLA | Wu, Yue et al. "Boosting small-molecule reduction with bismuth-based nanostructured reactors" . | CHEMICAL COMMUNICATIONS 61 . 58 (2025) : 10800-10803 . |
| APA | Wu, Yue , Zhang, Bozhao , Yu, Yuan , Jiang, Qinyu , Feng, Shanru , Lin, Yongjin et al. Boosting small-molecule reduction with bismuth-based nanostructured reactors . | CHEMICAL COMMUNICATIONS , 2025 , 61 (58) , 10800-10803 . |
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Achieving metal interconnects for printed circuit boards (PCBs) is pivotal for the electronics industry. Through electrochemical analysis of Basic Blue 7 (BB7), an excellent suppressing effect was observed. Chronopotentiometry was used to study the possible concentration range of BB7 for microvia filling and a BB7 concentration range of 50-150 mg L-1 was selected to achieve superfilling electrodeposition. A difunctional mechanism of coordination and adsorption of BB7 during electrodeposition is proposed based on density functional theory (DFT) calculations and in situ Raman spectroscopy analysis. The interaction among BB7, the copper substrate and Cu2+ leads to the suppression of copper growth. The superfilling electroplating process is optimized and high filling performance can be achieved at 100 mg L-1 with filling percentage (FP) values of 80.19%, 84.70% and 87.90% for microvias with diameters of 150 mu m, 125 mu m and 100 mu m, respectively. Besides, a differential diffusion filling mechanism is proposed for the blind microvia filling process of the newly proposed electroplating system based on the analyses of the interaction among additives and diffusion kinetics. Furthermore, the performance of the copper interconnect layer, including surface morphology, phase structure and signal transmittance, is evaluated.
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| GB/T 7714 | Li, Yaqiang , Peng, Xuesong , Li, Ruopeng et al. Insights into the role of Basic Blue 7 as a leveler in copper superfilling within microvias [J]. | NEW JOURNAL OF CHEMISTRY , 2025 , 49 (28) : 12079-12089 . |
| MLA | Li, Yaqiang et al. "Insights into the role of Basic Blue 7 as a leveler in copper superfilling within microvias" . | NEW JOURNAL OF CHEMISTRY 49 . 28 (2025) : 12079-12089 . |
| APA | Li, Yaqiang , Peng, Xuesong , Li, Ruopeng , Jiang, Jie , Meng, Fan , Wu, Youzheng et al. Insights into the role of Basic Blue 7 as a leveler in copper superfilling within microvias . | NEW JOURNAL OF CHEMISTRY , 2025 , 49 (28) , 12079-12089 . |
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