• Complex
  • Title
  • Keyword
  • Abstract
  • Scholars
  • Journal
  • ISSN
  • Conference
成果搜索

author:

Dai, Pinqiang (Dai, Pinqiang.) [1] | Li, Zhanjiang (Li, Zhanjiang.) [2] | Hong, Chunfu (Hong, Chunfu.) [3] | Chang, Fa (Chang, Fa.) [4] | Zhao, Xianrui (Zhao, Xianrui.) [5] | Chen, Li (Chen, Li.) [6] | Tian, Jun (Tian, Jun.) [7] | Chen, Hongxiang (Chen, Hongxiang.) [8] | Huang, Jianeng (Huang, Jianeng.) [9] | Tang, Qunhua (Tang, Qunhua.) [10]

Indexed by:

EI Scopus SCIE

Abstract:

FeCoCrNiMn high-entropy alloys (HEAs) exhibit excellent ductility, particularly at cryogenic temperatures. However, their yield strength is relatively low. In this study, an inexpensive element, phosphorus (P), was added to HEAs at a high concentration (0.4 %). The results indicate that adding P not only enhances both strength and ductility, but also avoids embrittlement. The P-added HEAs were single-phase random solid solutions, with P distributed inside the grains and partially segregated at the grain boundaries. Within the grains, regions rich in P and poor in P were observed, along with significant tensile and compressive strain fields in the P-rich regions. These strain fields may lead to large local internal stresses. The presence of P prevents brittleness due to its specific atomic distribution, whether in coarse or fine grains. The yield strength increased from 185.27 MPa in Pfree homogenized HEAs to 296.1 MPa in P-added HEAs, representing an increase of approximately 60 % at 298 K. At 77 K, the strengths further increased, irrespective of grain size. Further, P added reduced the stacking fault energy. At room temperature (298 K), P-free HEAs formed dislocation cells and high-density dislocation wall structures, while P-added HEAs formed additional microbands, deformation twins, and stacking faults due to increased lattice frictional stress. P-added HEAs demonstrated excellent mechanical properties at cryogenic temperatures, with good strength-ductility synergy and strain-hardening capacity. These enhancements can be attributed to the synergistic effects of nano deformation twins, hierarchical nano-spaced stacking fault networks, and Lomer-Cottrell locks, as well as their extensive interactions.

Keyword:

High-entropy alloys Mechanical properties P addition Room and cryogenics temperatures Solid-solution strengthening

Community:

  • [ 1 ] [Dai, Pinqiang]Fujian Univ Technol, Coll Mat Sci & Engn, Fuzhou 350118, Peoples R China
  • [ 2 ] [Hong, Chunfu]Fujian Univ Technol, Coll Mat Sci & Engn, Fuzhou 350118, Peoples R China
  • [ 3 ] [Chang, Fa]Fujian Univ Technol, Coll Mat Sci & Engn, Fuzhou 350118, Peoples R China
  • [ 4 ] [Tian, Jun]Fujian Univ Technol, Coll Mat Sci & Engn, Fuzhou 350118, Peoples R China
  • [ 5 ] [Chen, Hongxiang]Fujian Univ Technol, Coll Mat Sci & Engn, Fuzhou 350118, Peoples R China
  • [ 6 ] [Huang, Jianeng]Fujian Univ Technol, Coll Mat Sci & Engn, Fuzhou 350118, Peoples R China
  • [ 7 ] [Li, Zhanjiang]Jiangsu Maritime Inst, Sch Naval Architecture & Intelligent Mfg, Nanjing 211170, Peoples R China
  • [ 8 ] [Zhao, Xianrui]Jiangsu Maritime Inst, Sch Naval Architecture & Intelligent Mfg, Nanjing 211170, Peoples R China
  • [ 9 ] [Chen, Li]Fuzhou Univ, Zhicheng Coll, Dept Mat Engn, Fuzhou 350002, Peoples R China
  • [ 10 ] [Tang, Qunhua]Putian Univ, Sch Mech & Elect Engn, Putian 351100, Peoples R China

Reprint 's Address:

  • [Dai, Pinqiang]Fujian Univ Technol, Coll Mat Sci & Engn, Fuzhou 350118, Peoples R China

Show more details

Related Keywords:

Source :

MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING

ISSN: 0921-5093

Year: 2024

Volume: 920

6 . 1 0 0

JCR@2023

CAS Journal Grade:1

Cited Count:

WoS CC Cited Count:

SCOPUS Cited Count:

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 2

Online/Total:155/10916069
Address:FZU Library(No.2 Xuyuan Road, Fuzhou, Fujian, PRC Post Code:350116) Contact Us:0591-22865326
Copyright:FZU Library Technical Support:Beijing Aegean Software Co., Ltd. 闽ICP备05005463号-1