• Complex
  • Title
  • Keyword
  • Abstract
  • Scholars
  • Journal
  • ISSN
  • Conference
成果搜索

author:

Xueda Ding (Xueda Ding.) [1] | Yuxin Huang (Yuxin Huang.) [2] | Dongyang Chen (Dongyang Chen.) [3] | Zailai Xie (Zailai Xie.) [4] (Scholars:谢在来)

Indexed by:

CSCD

Abstract:

Constructing heterojunction interface as an active catalyst is an effective strategy to boost electrocatalytic activity of oxygen evolution reaction(OER).Herein,we report an interfacial CoP/CeO2 heterostructure catalyst constructed by interface engineering and selective phosphorization procedure.X-ray photo-electron spectroscopy(XPS)suggests that coupling CeO2 nanoparticles on the surface of CoP will generate interfacial interaction at the two-phase interface,resulting in electron transfer between CoP and CeO2 components at the interface.Benefitting from the interfacial interaction,large exposed inter-face area,and luxuriant mesopores structure,CoP/CeO2 shows fascinating alkaline OER performance.At the current densities of 10 and 50 mA cm-2,the optimal CoP/CeO2 heterojunction exhibits lower overpotential(257 and 298 mV)than either CoP(288 and 354 mV)or RuO2(305 and 409 mV).This work provides a facile synthetic protocol for constructing heterostructure interfaces to improve OER performance.

Keyword:

Community:

  • [ 1 ] [Zailai Xie]福州大学
  • [ 2 ] [Dongyang Chen]福州大学
  • [ 3 ] [Yuxin Huang]福州大学
  • [ 4 ] [Xueda Ding]福州大学

Reprint 's Address:

Email:

Show more details

Related Keywords:

Related Article:

Source :

颗粒学报(英文版)

ISSN: 1674-2001

CN: 11-5671/O3

Year: 2023

Issue: 10

Volume: 81

Page: 38-44

4 . 1

JCR@2023

4 . 1 0 0

JCR@2023

JCR Journal Grade:2

CAS Journal Grade:3

Cited Count:

WoS CC Cited Count:

SCOPUS Cited Count:

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 0

Online/Total:45/10109073
Address:FZU Library(No.2 Xuyuan Road, Fuzhou, Fujian, PRC Post Code:350116) Contact Us:0591-22865326
Copyright:FZU Library Technical Support:Beijing Aegean Software Co., Ltd. 闽ICP备05005463号-1