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author:

Xiong, F. (Xiong, F..) [1] | Sun, J. (Sun, J..) [2] | Tang, P. (Tang, P..) [3] | Guo, W. (Guo, W..) [4] | Dong, Y. (Dong, Y..) [5] | Du, Z. (Du, Z..) [6] | Feng, S. (Feng, S..) [7] | Li, X. (Li, X..) [8]

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Abstract:

A technique for the transfer-free growth of 2-inch wafer-scale patterned graphene directly on GaN LED epilayers is introduced. High-quality graphene as transparent electrodes and heat spreaders is synthesized directly on GaN by PECVD at only 600 °C deposition temperature and within 3 min growth time. Co acts as both the catalyst for graphene growth and the dry etching mask for GaN mesas, which greatly improves the efficiency of the semiconductor device process. Elegantly, the graphene growth is in accordance with the shape of Co, which offers a lithography-free patterning technique of the graphene. Afterward, using our penetration etching method through the PMMA and graphene layers, the Co is peacefully removed, and in-situ Ohmic contact is achieved between the graphene and p-GaN where the contact resistivity is only 0.421 Ω cm2. The graphene sheet resistance is as low as 631.2 Ω sq−1. The device is also superior to the counterpart graphene-free LED in terms of heat spreading behavior, as evidenced by the lower junction temperature and thermal resistance. Most importantly, the developed technique produces graphene with excellent performance and is intrinsically more scalable, controllable, and semiconductor industry compatible than traditionally transferred graphene. © 2023, Springer Nature Limited.

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  • [ 1 ] [Xiong F.]Key Laboratory of Optoelectronics Technology, College of Microelectronics, Beijing University of Technology, Beijing, China
  • [ 2 ] [Sun J.]Fujian Science & Technology Innovation Laboratory for Optoelectronic Information of China, and National and Local United Engineering Laboratory of Flat Panel Display Technology, College of Physics and Information Engineering, Fuzhou University, Fuzhou, China
  • [ 3 ] [Sun J.]Quantum Device Physics Laboratory, Department of Microscience and Nanotechnology, Chalmers University of Technology, Göteborg, Sweden
  • [ 4 ] [Tang P.]Key Laboratory of Optoelectronics Technology, College of Microelectronics, Beijing University of Technology, Beijing, China
  • [ 5 ] [Guo W.]Key Laboratory of Optoelectronics Technology, College of Microelectronics, Beijing University of Technology, Beijing, China
  • [ 6 ] [Dong Y.]Key Laboratory of Optoelectronics Technology, College of Microelectronics, Beijing University of Technology, Beijing, China
  • [ 7 ] [Du Z.]Key Laboratory of Optoelectronics Technology, College of Microelectronics, Beijing University of Technology, Beijing, China
  • [ 8 ] [Feng S.]Key Laboratory of Optoelectronics Technology, College of Microelectronics, Beijing University of Technology, Beijing, China
  • [ 9 ] [Li X.]Key Laboratory of Optoelectronics Technology, College of Microelectronics, Beijing University of Technology, Beijing, China

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Source :

npj 2D Materials and Applications

ISSN: 2397-7132

Year: 2023

Issue: 1

Volume: 7

9 . 2

JCR@2023

9 . 2 0 0

JCR@2023

JCR Journal Grade:1

CAS Journal Grade:2

Cited Count:

WoS CC Cited Count:

SCOPUS Cited Count:

ESI Highly Cited Papers on the List: 0 Unfold All

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Chinese Cited Count:

30 Days PV: 0

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