With　the　miniaturization　and　integration　of　electronic　products,　the　heat　dissipation　efficiency　of　electronic　equipment　needs　to　be　further　improved.　Notably,　polymer　materials　are　a　choice　for　electronic　equipment　matrices　because　of　their　advantages　of　low　cost　and　wide　application　availability.　However,　the　thermal　conductivity　of　polymers　is　insufficient　to　meet　heat　dissipation　requirements,　and　their　improvements　remain　challenging.　For　decades,　as　an　efficient　manufacturing　technology,　additive　manufacturing　has　gradually　attracted　public　attention,　and　researchers　have　also　used　this　technology　to　produce　new　thermally　conductive　polymer　materials.　Here,　we　review　the　recent　research　progress　of　different　3D　printing　technologies　in　heat　conduction　and　the　thermal　conduction　mechanism　of　polymer　matrix　composites.　Based　on　the　classification　of　fillers,　the　research　progress　of　thermally　conductive　materials　prepared　by　fused　filament　fabrication　(FFF)　is　discussed.　It　analyzes　the　internal　relationship　between　FFF　process　parameters　and　the　thermal　conductivity　of　polymer　matrix　composites.　Finally,　this　study　summarizes　the　application　and　future　development　direction　of　thermally　conductive　composites　by　FFF.