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author:

Liao, Juan (Liao, Juan.) [1] | Zhou, Shaocong (Zhou, Shaocong.) [2] | Xue, Xin (Xue, Xin.) [3]

Indexed by:

EI

Abstract:

With a view to reducing the springback and twist of PEEK during the incremental forming process, the ultrasonic vibration is introduced into polymer thermal single-point incremental forming process (SPIF). In this study, the effects of temperature and ultrasonic vibration on twist and springback of formed parts are investigated. Several modified tool trajectories are developed, and the influence of tool trajectory on twist and springback are also studied. Finally, the microstructures of PEEK parts are analyzed by XRD. The results show that the increase of temperature is helpful to reduce the twist and springback. The ultrasonic vibration is beneficial to the improvement of geometric accuracy, while the side wall bulge aggravates at 140  after the ultrasonic vibration is applied. The optimized tool trajectory can effectively eliminate twist and reduce the springback of PEEK parts. The XRD result shows that the ultrasonic vibration is helpful to increase the molecular chain orientation, improve crystallinity, and refine crystallite at 60  and 100 . However, the opposite trend occurs at 140  due to the disorientation effect of molecular chain. © 2022, The Author(s), under exclusive licence to Springer-Verlag London Ltd., part of Springer Nature.

Keyword:

Crystallinity Crystallites Microstructure Molecular orientation Temperature Trajectories Ultrasonic effects Ultrasonic waves Vibration analysis X ray diffraction

Community:

  • [ 1 ] [Liao, Juan]School of Mechanical Engineering and Automation, Fuzhou University, Fuzhou; 350116, China
  • [ 2 ] [Zhou, Shaocong]School of Mechanical Engineering and Automation, Fuzhou University, Fuzhou; 350116, China
  • [ 3 ] [Xue, Xin]School of Mechanical Engineering and Automation, Fuzhou University, Fuzhou; 350116, China

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Source :

International Journal of Advanced Manufacturing Technology

ISSN: 0268-3768

Year: 2022

Issue: 7-8

Volume: 121

Page: 5269-5282

3 . 4

JCR@2022

2 . 9 0 0

JCR@2023

ESI HC Threshold:66

JCR Journal Grade:2

CAS Journal Grade:3

Cited Count:

WoS CC Cited Count:

SCOPUS Cited Count:

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 0

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