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author:

Chen, Hongsheng (Chen, Hongsheng.) [1] | Liu, Wenwei (Liu, Wenwei.) [2] | Chen, Zhiwei (Chen, Zhiwei.) [3] | Zheng, Zhong (Zheng, Zhong.) [4]

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EI

Abstract:

A four-way coupling CFD-DEM model is originally developed in this work to investigate the sedimentation of adhesive particles in viscous fluids. In this model, the particles are traced by the discrete element method based on the JKR contacting theory, and the fluid flow is resolved by the lattice Boltzmann method combining with large eddy simulation. Three benchmark problems are first investigated to validate the LBM-LES-DEM scheme, and then the sedimentations of non-adhesive and adhesive particles are further discussed in detail. Results indicate that the drafting-kissing-tumbling process identified during the settling of non-adhesive particles is significantly different from that of adhesive ones, and separation will not happen if the vdW adhesion between particles becomes strong enough. Moreover, the settling of adhesive particles is found to be faster than non-adhesive ones, and this can be reasonably interpreted by the agglomeration effect that takes place during the settling of adhesive particles. © 2021 Elsevier B.V.

Keyword:

Adhesives Agglomeration Computational fluid dynamics Large eddy simulation Lattice theory Sedimentation Viscosity Viscous flow

Community:

  • [ 1 ] [Chen, Hongsheng]Department of Metallurgical Engineering, College of Materials Science and Engineering, Chongqing University, Chongqing; 400044, China
  • [ 2 ] [Liu, Wenwei]Department of Chemical and Process Engineering, University of Surrey, Guildford; UK; GU2 7XH, United Kingdom
  • [ 3 ] [Chen, Zhiwei]School of Chemical Engineering, Fuzhou University, Fuzhou; 350116, China
  • [ 4 ] [Zheng, Zhong]Department of Metallurgical Engineering, College of Materials Science and Engineering, Chongqing University, Chongqing; 400044, China

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Source :

Powder Technology

ISSN: 0032-5910

Year: 2021

Volume: 391

Page: 467-478

5 . 6 4

JCR@2021

4 . 5 0 0

JCR@2023

ESI HC Threshold:117

JCR Journal Grade:1

CAS Journal Grade:2

Cited Count:

WoS CC Cited Count:

SCOPUS Cited Count: 16

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 3

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