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author:

Yang, Yuan (Yang, Yuan.) [1] | Zhou, Wenbo (Zhou, Wenbo.) [2] | Chen, Xuyang (Chen, Xuyang.) [3] | Ye, Jinhua (Ye, Jinhua.) [4] (Scholars:叶锦华) | Wu, Haibin (Wu, Haibin.) [5] (Scholars:吴海彬)

Indexed by:

EI SCIE

Abstract:

Tactile sensing is very important for human-machine interaction. A new non-array flexible touching sensor based on variation of electrical impedance distribution (VEID) is proposed to detect position and pressure of external touching. The sensor includes two layers of piezoresistive film, and there are 16 electrodes at the inner and boundary of the film. Two of the electrodes are used for stimulation, and the others are used for monitoring. When the sensor is exposed to different touching, the monitoring electrodes will output different signals. The SVM algorithm is adopted for modeling the relation between the different touching and signals of the monitoring electrodes. Experiments are performed to evaluate the sensor's ability, and the results show that the fabricated sensor can distinguish different touching position and different pressure of the loads with high accuracy. Moreover, the sensor is flexible, easy to fabricate, and can be used for different scenarios for human-machine interaction.

Keyword:

Classification Electrical impedance distribution Machine learning Tactile sensor

Community:

  • [ 1 ] [Yang, Yuan]Fuzhou Univ, Sch Mech Engn & Automat, Fuzhou 350116, Peoples R China
  • [ 2 ] [Zhou, Wenbo]Fuzhou Univ, Sch Mech Engn & Automat, Fuzhou 350116, Peoples R China
  • [ 3 ] [Chen, Xuyang]Fuzhou Univ, Sch Mech Engn & Automat, Fuzhou 350116, Peoples R China
  • [ 4 ] [Ye, Jinhua]Fuzhou Univ, Sch Mech Engn & Automat, Fuzhou 350116, Peoples R China
  • [ 5 ] [Wu, Haibin]Fuzhou Univ, Sch Mech Engn & Automat, Fuzhou 350116, Peoples R China

Reprint 's Address:

  • 吴海彬

    [Wu, Haibin]Fuzhou Univ, Sch Mech Engn & Automat, Fuzhou 350116, Peoples R China

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Related Keywords:

Source :

MEASUREMENT

ISSN: 0263-2241

Year: 2021

Volume: 183

5 . 1 3 1

JCR@2021

5 . 2 0 0

JCR@2023

ESI Discipline: ENGINEERING;

ESI HC Threshold:105

JCR Journal Grade:1

CAS Journal Grade:2

Cited Count:

WoS CC Cited Count: 3

SCOPUS Cited Count:

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 2

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