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author:

吴本生 (吴本生.) [1] | 杨晓华 (杨晓华.) [2] | 陈文哲 (陈文哲.) [3]

Indexed by:

CQVIP

Abstract:

介绍了无铅焊接技术的现状以及国内外对Sn-Ag和Sn-Zn等二元无铅焊料的研究成果,以及无铅焊接的几种常见技术.

Keyword:

发展现状 微电子封装 无铅焊接

Community:

  • [ 1 ] 福州大学材料科学与工程学院,福州,350002 福州大学材料科学与工程学院,福州,350002 福州大学材料科学与工程学院,福州,350002

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Source :

理化检验:物理分册

ISSN: 1001-4012

Year: 2005

Issue: z1

Page: 77-81

Cited Count:

WoS CC Cited Count:

SCOPUS Cited Count:

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count: -1

30 Days PV: 0

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