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author:

刘雪华 (刘雪华.) [1] | 唐电 (唐电.) [2]

Indexed by:

CQVIP PKU CSCD

Abstract:

采用电偶电流法研究了甲基磺酸锡镀液中,锡离子质量浓度、甲基磺酸体积分数、硫脲质量浓度、温度等参数对镀覆效果的影响,得出了优化工艺参数如下:40g/L甲基磺酸锡、150mL/L甲基磺酸,100g/L硫脲,温度70℃。采用优化工艺在铜基体上得到的锡镀层致密、光亮,晶粒尺寸小于20nm。

Keyword:

甲基磺酸锡 电偶电流法 置换镀锡

Community:

  • [ 1 ] 福建工程学院,福建福州350014
  • [ 2 ] 福州大学材料研究所,福建福州350018

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Source :

电镀与涂饰

ISSN: 1004-227X

Year: 2008

Issue: 12

Page: 20-22

Cited Count:

WoS CC Cited Count:

SCOPUS Cited Count:

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count: -1

30 Days PV: 1

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