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author:

林鸿扬 (林鸿扬.) [1] | 王炳喜 (王炳喜.) [2] (Scholars:王炳喜) | 林春莺 (林春莺.) [3]

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CQVIP

Abstract:

采用置换反应方法在铜粉表面镀银,用XRD、SEM表征镀银铜粉结构,柱塞式测试装置评价镀银铜粉的导电性.把镀银铜粉与高密度聚乙烯熔融复合制备PTC复合材料,然后进行电阻-温度曲线测试.结果表明,含银15%的镀银铜粉即具有良好的导电性,当镀银铜粉的填充质量为82%时,复合材料的室温电阻率仅有2.77Ω·cm,PTC强度高达8.4个数量级,NTC效应也较为显著.

Keyword:

PTC效应 SEM 低电阻率 复合材料 镀银铜粉

Community:

  • [ 1 ] [林鸿扬]福州大学
  • [ 2 ] [王炳喜]福州大学
  • [ 3 ] [林春莺]福州大学

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Source :

化工时刊

ISSN: 1002-154X

CN: 32-1320/TQ

Year: 2006

Issue: 2

Volume: 20

Page: 4-6,11

Cited Count:

WoS CC Cited Count:

SCOPUS Cited Count:

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 1

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