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Abstract:
采用置换反应方法在铜粉表面镀银,用XRD、SEM表征镀银铜粉结构,柱塞式测试装置评价镀银铜粉的导电性.把镀银铜粉与高密度聚乙烯熔融复合制备PTC复合材料,然后进行电阻-温度曲线测试.结果表明,含银15%的镀银铜粉即具有良好的导电性,当镀银铜粉的填充质量为82%时,复合材料的室温电阻率仅有2.77Ω·cm,PTC强度高达8.4个数量级,NTC效应也较为显著.
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化工时刊
ISSN: 1002-154X
CN: 32-1320/TQ
Year: 2006
Issue: 2
Volume: 20
Page: 4-6,11
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SCOPUS Cited Count:
ESI Highly Cited Papers on the List: 0 Unfold All
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30 Days PV: 1
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