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author:

朱晓林 (朱晓林.) [1] (Scholars:朱晓林) | 黄敏纯 (黄敏纯.) [2] (Scholars:黄敏纯)

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CQVIP

Abstract:

本文以钻孔用分度夹具为例,对虚拟装配过程和关键技术进行研究,包括零件三维造型方法、虚拟装配顺序和路径规划,夹具虚拟装配过程的实现等.在机械制造领域,利用X3D技术实现夹具虚拟装配,具有非常重要的现实意义.

Keyword:

X3D 三维造型 虚拟装配 路径规划

Community:

  • [ 1 ] [朱晓林]福州大学
  • [ 2 ] [黄敏纯]福州大学

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Source :

机电技术

ISSN: 1672-4801

CN: 35-1262/TH

Year: 2009

Issue: 4

Volume: 32

Page: 19-20,28

Cited Count:

WoS CC Cited Count: 0

SCOPUS Cited Count:

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count: -1

Chinese Cited Count:

30 Days PV: 3

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