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author:

吴永泉 (吴永泉.) [1] | 杨开怀 (杨开怀.) [2] | 陈文哲 (陈文哲.) [3]

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CQVIP PKU CSCD

Abstract:

以商业5052铝合金为载体材料,研究了限制模压(CGP)变形过程中材料组织和显微硬度的变化规律,并讨论了CGP模具齿宽的影响.结果表明:晶粒从退火态的25 μm经变形后得到了细化.经变形后试样的组织产生类似余弦函数图形的起伏弯曲现象,试样组织经4#模压制后的弯曲程度与经2#模压制的相似.模具的齿宽对试样的显微硬度平均值影响不大,而经2#模压制后的显微硬度均匀性较好.

Keyword:

5052铝合金 显微硬度 金相组织 限制模压(CGP)

Community:

  • [ 1 ] [吴永泉]福州大学
  • [ 2 ] [杨开怀]福州大学
  • [ 3 ] [陈文哲]福州大学

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Source :

热加工工艺

ISSN: 1001-3814

CN: 61-1133/TG

Year: 2009

Issue: 12

Volume: 38

Page: 8-11,14

Cited Count:

WoS CC Cited Count: 0

SCOPUS Cited Count:

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count: -1

Chinese Cited Count:

30 Days PV: 3

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