Abstract:
常见的玻璃芯片的分离管道多为线状,样品负载较小。本文介绍了一种制作快速的,具有薄膜状分离管道的微流控芯片。不同于常见的玻璃芯片,这种芯片拥有宽达2—3mm的分离管道,薄膜状管道使芯片具有高效的散热性能,分离电压和管电流之间具有良好的伏安线性。
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Year: 2009
Page: 263-264
Language: Chinese
Cited Count:
SCOPUS Cited Count:
ESI Highly Cited Papers on the List: 0 Unfold All
WanFang Cited Count: -1
Chinese Cited Count:
30 Days PV: 2
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