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author:

李衍川 (李衍川.) [1] | 江和 (江和.) [2] (Scholars:江和) | 刘向军 (刘向军.) [3] (Scholars:刘向军)

Abstract:

探讨了低压电器触头电接触瞬态热分析的数学模型,并利用ANSYS软件对热过程的相变问题进行分析,得出触头熔焊过程中,温度随时间的变化情况,并由此计算熔焊力.之后改变触头材料,分别进行仿真和计算对应的熔焊力.最后提出抗熔焊措施,确保电器可靠工作.

Keyword:

低压电器 抗熔焊性能 瞬态热分析 计算方法

Community:

  • [ 1 ] [李衍川]福州大学
  • [ 2 ] [江和]福州大学
  • [ 3 ] [刘向军]福州大学

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Year: 2013

Page: 1-4

Language: Chinese

Cited Count:

WoS CC Cited Count:

SCOPUS Cited Count:

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count: -1

Chinese Cited Count:

30 Days PV: 3

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