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author:

Lin, X.Z. (Lin, X.Z..) [1] | Ying, J. (Ying, J..) [2] | Huang, J.M. (Huang, J.M..) [3]

Indexed by:

Scopus

Abstract:

Electrostatic micro-devices are simple but important for MEMS applications. Precise dynamic descriptions of these devices are often hard to obtain due to the electrostatic nonlinearity and the fluid-structure interactions in devices. Here we present a comprehensive electrostaticmechanical- fluidic coupling transient analysis for the pull-in process of two ends fixed micro-plate device. The numerical results are compared with the published experiment works of other researchers available in the literature, and thus the model had been validated. After that the proper orthogonal decomposition approach is performed for the snapshot matrixes which are sampled from an ensemble of the fully finite element results. The resulted spatial distribution modes of pressure show a higher spatial frequency toward the middle of the micro-plate, which indicates that the pressures at the moving edges of the plate are not equal to ambient pressure. Due to the increasing demands for simulation accuracy, the electrostatic- mechanical interactions and the nonlinear features of viscous loss from the surrounding fluid have to be taken into account in details. © 2013 Trans Tech Publications Ltd, Switzerland.

Keyword:

Electrostatic-mechanical interaction; Fluid-structure interaction; Numerical simulation; Pull-in

Community:

  • [ 1 ] [Lin, X.Z.]College of Mechanical Engineering and Automation, Fuzhou University, Fuzhou, Fujian, China
  • [ 2 ] [Ying, J.]Institute of Modern Manufacturing Engineering, Zhejiang University, Hangzhou, Zhejiang, China
  • [ 3 ] [Huang, J.M.]College of Mechanical Engineering and Automation, Fuzhou University, Fuzhou, Fujian, China

Reprint 's Address:

  • [Lin, X.Z.]College of Mechanical Engineering and Automation, Fuzhou University, Fuzhou, Fujian, China

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Source :

Key Engineering Materials

ISSN: 1013-9826

Year: 2013

Volume: 562-565

Page: 637-642

Language: English

0 . 2 2 4

JCR@2005

Cited Count:

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SCOPUS Cited Count:

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 0

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