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author:

Yan, W. (Yan, W..) [1] | Fu, G. (Fu, G..) [2] | Chen, H. (Chen, H..) [3] | Chen, G. (Chen, G..) [4] | Ma, B. (Ma, B..) [5]

Indexed by:

Scopus

Abstract:

Microstructure evolution behavior of 1235 aluminum alloy under different deformation conditions was studied by hot compression simulation, along with OM, TEM. The law of microstructure evolution at hot deformation was also analyzed. The results showed that the dynamic recrystallization behavior of 1235 aluminum alloy was obvious during hot deformation. At higher deformation temperature or lower strain rate, the grain dislocation density was lower and grain boundaries tended to be straighter, therefore, the grains dynamic recrystallized more adequately. The recrystal grains were smaller and distributed uniformly at deformation temperature for 400°C and stress rate for 0.1s -1 with the average grain size for 54.03μm. © (2011) Trans Tech Publications, Switzerland.

Keyword:

1235 aluminum alloy; Dynamic recrystallization; Hot compression deformation; Microstructure evolution

Community:

  • [ 1 ] [Yan, W.]Department of Materials, Fuzhou University, Fuzhou 350108, China
  • [ 2 ] [Yan, W.]Fujian Communications Technology College, Fuzhou 350007, China
  • [ 3 ] [Fu, G.]Department of Materials, Fuzhou University, Fuzhou 350108, China
  • [ 4 ] [Fu, G.]Fujian Communications Technology College, Fuzhou 350007, China
  • [ 5 ] [Chen, H.]Department of Materials, Fuzhou University, Fuzhou 350108, China
  • [ 6 ] [Chen, G.]Department of Materials, Fuzhou University, Fuzhou 350108, China
  • [ 7 ] [Chen, G.]Fujian Communications Technology College, Fuzhou 350007, China
  • [ 8 ] [Ma, B.]Department of Materials, Fuzhou University, Fuzhou 350108, China

Reprint 's Address:

  • [Yan, W.]Department of Materials, Fuzhou University, Fuzhou 350108, China

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Source :

Applied Mechanics and Materials

ISSN: 1660-9336

Year: 2011

Volume: 66-68

Page: 1515-1521

Language: English

Cited Count:

WoS CC Cited Count:

SCOPUS Cited Count:

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 2

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