Nanostructured materials for microelectronic applications - Details

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author：

Chang, S.-J. (Chang, S.-J..) ^[1] | Meen, T.-H. (Meen, T.-H..) ^[2] | Prior, S.D. (Prior, S.D..) ^[3] | Lam, A.D.K.-T. (Lam, A.D.K.-T..) ^[4] | Ji, L.-W. (Ji, L.-W..) ^[5]

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[ 1 ] [Chang, S.-J.]Department of Electrical Engineering, Institute of Microelectronics, National Cheng Kung University, Tainan 701, Taiwan
[ 2 ] [Meen, T.-H.]Department of Electronic Engineering, National Formosa University, Yunlin 632, Taiwan
[ 3 ] [Prior, S.D.]Aeronautics, Astronautics and Computational Engineering, University of Southampton, Southampton SO17 1BJ, United Kingdom
[ 4 ] [Lam, A.D.K.-T.]College of Physics and Information Engineering, Fuzhou University, Fuzhou 350116, Fujian, China
[ 5 ] [Ji, L.-W.]Institute of Electro-Optical and Materials Science, National Formosa University, Yunlin 632, Taiwan

Reprint 's Address：

[Chang, S.-J.]Department of Electrical Engineering, Institute of Microelectronics, National Cheng Kung University, Tainan 701, Taiwan

Email：

changsj@mail.ncku.edu.tw

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ISSN： 1687-8434

Year： 2014

Volume： 2014

Language： English

0 . 7 4 4

JCR@2014

2 . 0 9 8

JCR@2021

JCR Journal Grade：4

CAS Journal Grade：4

Cited Count：

WoS CC Cited Count：

SCOPUS Cited Count：

ESI Highly Cited Papers on the List： 0 Unfold All

WanFang Cited Count：

Chinese Cited Count：

30 Days PV： 0

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